- Manufacturer：
-
- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Core Processor：
-
- Voltage - I/O：
-
- Number of Cores/Bus Width：
-
- Co-Processors/DSP：
-
- RAM Controllers：
-
- Ethernet：
-
- Security Features：
-
- Selected conditions:
Discover 88 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|
|
|
Cirrus Logic Inc. |
7,567
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU EP9 200MHZ 208LQFP
|
Tray | EP9 | 0°C ~ 70°C (TA) | 208-LQFP | 208-LQFP | ARM920T | 1.8V，3.3V | 1 Core，32-Bit | Math Engine; MaverickCrunch® | SDRAM | 1/10/100 Mbps (1) | USB 2.0 (2) | Hardware ID | ||
|
|
|
NXP USA Inc. |
184
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | - | - | - | ||
|
|
|
Texas Instruments |
986
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-L1X 200MHZ 361NFBGA
|
Tray | OMAP-L1x | 0°C ~ 90°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | LPDDR，DDR2 | 10/100 Mbps (1) | USB 2.0 + PHY (1) | - | ||
|
|
|
Texas Instruments |
1,961
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-L1X 200MHZ 361NFBGA
|
Tray | OMAP-L1x | -40°C ~ 105°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | LPDDR，DDR2 | 10/100 Mbps (1) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
21
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | - | - | - | ||
|
|
|
Intel |
2
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 200MHZ 520BGA
|
Tray | - | 0°C ~ 70°C (TA) | 520-LFBGA | 520-HL-PBGA (40x40) | StrongARM | 3.3V | 1 Core，32-Bit | Data; Microengine | SDRAM | - | - | - | ||
|
|
|
Cirrus Logic Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU EP9 200MHZ 208LQFP
|
Tray | EP9 | -40°C ~ 85°C (TA) | 208-LQFP | 208-LQFP | ARM920T | 1.8V，3.3V | 1 Core，32-Bit | Math Engine; MaverickCrunch® | SDRAM | 1/10/100 Mbps (1) | USB 2.0 (2) | Hardware ID | ||
|
|
|
Texas Instruments |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU OMAP-L1X 200MHZ 361NFBGA
|
Tape & Reel (TR) | OMAP-L1x | -40°C ~ 105°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | LPDDR，DDR2 | 10/100 Mbps (1) | USB 2.0 + PHY (1) | - | ||
|
|
|
Texas Instruments |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MPU OMAP-L1X 200MHZ 361NFBGA
|
Tray | OMAP-L1x | -40°C ~ 105°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | LPDDR，DDR2 | 10/100 Mbps (1) | USB 2.0 + PHY (1) | - | ||
|
|
|
Intel |
1
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 200MHZ 432BGA
|
Tray | - | 0°C ~ 70°C (TA) | 432-LBGA | 432-BGA (40x40) | StrongARM | 3.3V | 1 Core，32-Bit | Data; Microengine | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 200MHZ 369BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 200MHZ 369BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 200MHZ 369BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 200MHZ 369BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 200MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 200MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 200MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 200MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - |
