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Discover 79 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
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Microchip Technology |
500
|
3 days |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
|
|
|
Texas Instruments |
1,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
SITARA PROCESSOR: ARM CORTEX-A8,
|
Sitara | 0°C ~ 90°C (TJ) | 289-LFBGA | 298-NFBGA (13x13) | ARM® Cortex®-A8 | 1.8V，3.3V | 300MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2，DDR3，DDR3L | Yes | LCD，Touchscreen | - | USB 2.0 + PHY (1) | Cryptography，Random Number Generator | ||
|
|
|
Texas Instruments |
3,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
SITARA PROCESSOR: ARM CORTEX-A8,
|
Sitara | 0°C ~ 90°C (TJ) | 298-LFBGA | 298-NFBGA (13x13) | ARM® Cortex®-A8 | 1.8V，3.3V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2，DDR3，DDR3L | Yes | LCD，Touchscreen | - | USB 2.0 + PHY (1) | Cryptography，Random Number Generator | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
|
Texas Instruments |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
SITARA PROCESSOR: ARM CORTEX-A8
|
Sitara | -40°C ~ 105°C (TJ) | 298-LFBGA | 298-NFBGA (13x13) | ARM® Cortex®-A8 | 1.8V，3.3V | 300MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2，DDR3，DDR3L | Yes | LCD，Touchscreen | - | USB 2.0 + PHY (1) | Cryptography，Random Number Generator | ||
|
|
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NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
SAMA5D3 | -40°C ~ 105°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6D 852MHZ 624FCBGA
|
i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
II.MX 6S ROM PERF ENHAN
|
i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection |
