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Discover 22 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | ||
NXP USA Inc. |
1,129
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
230
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
911
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
156
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Cut Tape (CT) | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
- | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
II.MX 6S ROM PERF ENHAN
|
Tray | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
49
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
II.MX 6S ROM PERF ENHAN
|
Tape & Reel (TR) | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
I.MX 6S ROM PERF ENHAN
|
Tray | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
I.MX 6DL ROM PERF ENHAN
|
Tray | i.MX6DL | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 152 MPQ: 1
|
NO EPDC,1 ETH,NO CAN,1 OTG 1
|
Tray | i.MX7S | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7,ARM® Cortex®-M4 | 1.8V,3.3V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LPDDR3,DDR3,DDR3L | No | Keypad,LCD,MIPI | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (1) | A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS |