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Discover 180 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
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NXP USA Inc. |
734
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
1,080
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 133MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
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NXP USA Inc. |
101
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
128
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 500MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | - | ||
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|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 66MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
103
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 133MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Bulk | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Bulk | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 500MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
89
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 500MHz，167MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 400MHz，167MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | USB 2.0 (1) | Cryptography，Random Number Generator |
