- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Security Features:
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- Selected conditions:
Discover 90 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Ethernet | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Ethernet | Security Features | ||
NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
1,260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
|
MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | - | DDR2 | 10/100/1000 Mbps (3) | - | ||||
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
139
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
2,324
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | - | ||||
NXP USA Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | 10/100 Mbps (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
32
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 489BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V,2.5V,3.3V | Communications; QUICC Engine | DDR,DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | - | ||||
NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | 10/100 Mbps (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
57
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | - | ||||
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
|
MPC83XX | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | - | DDR2 | 10/100/1000 Mbps (3) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V,2.5V,3.3V | Communications; QUICC Engine,Security; SEC 2.2 | DDR,DDR2 | 10/100 Mbps (3) | Cryptography | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MPU MPC83XX 266MHZ 489BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
|
MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | - | DDR2 | 10/100/1000 Mbps (3) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | Communications; QUICC Engine | DDR2 | 10/100 Mbps (3) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
|
MPC83XX | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | - | DDR2 | 10/100/1000 Mbps (3) | - |