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- Series：
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- Operating Temperature：
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- Supplier Device Package：
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- Core Processor：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- Selected conditions:
Discover 22 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | |
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NXP USA Inc. |
305
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 450MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
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NXP USA Inc. |
368
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
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NXP USA Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
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NXP USA Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
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NXP USA Inc. |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
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NXP USA Inc. |
3
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
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NXP USA Inc. |
5
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
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NXP USA Inc. |
21
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
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STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 504 MPQ: 1
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LFBGA16X16X1.7 361 F
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- | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | ARM® Cortex®-M3 | SDRAM | Yes | LCD，Touchscreen | - | ||
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STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 1300 MPQ: 1
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LFBGA16X16X1.7 361 F
|
- | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | ARM® Cortex®-M3 | SDRAM | Yes | LCD，Touchscreen | - | ||
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STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 504 MPQ: 1
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LFBGA16X16X1.7 361 F
|
- | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | ARM® Cortex®-M3 | SDRAM | Yes | LCD，Touchscreen | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | ||
|
|
|
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 1056 MPQ: 1
|
TFBGA11SQX1.2 256 F1
|
- | -40°C ~ 85°C (TA) | 256-TFBGA | 256-TFBGA (11x11) | ARM® Cortex®-R4 | ARM® Cortex®-M3 | SDRAM | No | LCD，Touchscreen | - |
