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Discover 161 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Security Features | |
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NXP USA Inc. |
453
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC83XX 417MHZ 489BGA
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MPC83XX | -40°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 417MHz | Communications; QUICC Engine | DDR2 | - | ||
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NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
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|
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NXP USA Inc. |
305
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
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NXP USA Inc. |
368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
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NXP USA Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
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NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
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NXP USA Inc. |
79
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 333MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
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NXP USA Inc. |
139
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 266MHz | Communications; QUICC Engine | DDR2 | - | ||
|
|
|
NXP USA Inc. |
2,324
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 266MHz | Communications; QUICC Engine | DDR2 | - | ||
|
|
|
NXP USA Inc. |
360
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 489BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 400MHz | Communications; QUICC Engine | DDR2 | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
29
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 333MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
252
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 369BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 333MHz | Communications; QUICC Engine | DDR2 | - | ||
|
|
|
NXP USA Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
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NXP USA Inc. |
3
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
5
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 489BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 333MHz | Communications; QUICC Engine | DDR2 | - | ||
|
|
|
NXP USA Inc. |
32
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 489BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 266MHz | Communications; QUICC Engine | DDR2 | - | ||
|
|
|
NXP USA Inc. |
18
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 489BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 400MHz | Communications; QUICC Engine | DDR2 | - |
