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- Core Processor：
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- RAM Controllers：
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Discover 99 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Security Features | |
|
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NXP USA Inc. |
734
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
1,080
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 133MHz | Communications; CPM | DRAM | - | ||
|
|
|
NXP USA Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
101
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 66MHz | Communications; CPM | DRAM | - | ||
|
|
|
NXP USA Inc. |
103
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 133MHz | Communications; CPM | DRAM | - | ||
|
|
|
NXP USA Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 300MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
57
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
607
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 300MHz | Communications; RISC CPM | DRAM，SDRAM | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU MPC8XX 80MHZ 256BGA
|
MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 80MHz | Communications; CPM | DRAM | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 66MHz | Communications; CPM | DRAM | - |
