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Discover 39 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | Security Features | |
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NXP USA Inc. |
990
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX27 400MHZ 404MAPBGA
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Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
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NXP USA Inc. |
870
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tray | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
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NXP USA Inc. |
313
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
773
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
1,385
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
1,353
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
450
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
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NXP USA Inc. |
150
|
3 days |
-
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MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
159
|
3 days |
-
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MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
92
|
3 days |
-
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MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 756 MPQ: 1
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IC MPU SPEAR 333MHZ 289LFBGA
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Tray | SPEAr | -40°C ~ 85°C (TC) | 289-LFBGA | 289-LFBGA | ARM926EJ-S | 3.3V | 333MHz | 1 Core，32-Bit | Security; C3 | LPDDR，DDR2 | No | Keyboard，LCD，Touchscreen | 10/100 Mbps (1) | Cryptography | ||
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STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 756 MPQ: 1
|
IC MPU SPEAR 333MHZ 289LFBGA
|
Tray | SPEAr | -40°C ~ 85°C (TC) | 289-LFBGA | 289-LFBGA | ARM926EJ-S | 3.3V | 333MHz | 1 Core，32-Bit | Security; C3 | LPDDR，DDR2 | No | - | 10/100 Mbps (5) | Cryptography | ||
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STMicroelectronics |
Inquiry
|
- |
-
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MOQ: 360 MPQ: 1
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IC MPU SPEAR 333MHZ 420BGA
|
Tray | SPEAr | -40°C ~ 85°C (TC) | 420-FBGA | 420-PBGA | ARM926EJ-S | 3.3V | 333MHz | 2 Core，32-Bit | - | DDR，DDR2 | No | LCD，Touchscreen | 10/100/1000 Mbps (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tape & Reel (TR) | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tape & Reel (TR) | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 160 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 160 MPQ: 1
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IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tape & Reel (TR) | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory |
