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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Number of Cores/Bus Width:
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- Co-Processors/DSP:
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- RAM Controllers:
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Discover 31 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Ethernet | ||
Intel |
1
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 166MHZ 432BGA
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- | 0°C ~ 70°C (TA) | 432-LBGA | 432-BGA (40x40) | StrongARM | 3.3V | 1 Core,32-Bit | Data; Microengine | SDRAM | - | ||||
Intel |
1
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 166MHZ 520BGA
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- | 0°C ~ 70°C (TA) | 520-LFBGA | 520-HL-PBGA (40x40) | StrongARM | 3.3V | 1 Core,32-Bit | Data; Microengine | SDRAM | - | ||||
Intel |
1
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU STRONGARM 166MHZ 432BGA
|
- | 0°C ~ 70°C (TA) | 432-LBGA | 432-BGA (40x40) | StrongARM | 3.3V | 1 Core,32-Bit | Data; Microengine | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 166MHZ 357BGA
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MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core,32-Bit | - | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MPU M683XX 166MHZ 100LQFP
|
M683xx | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | M68000 | 3.3V | 1 Core,8/16-Bit | Communications; RISC CPM | DRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 90 MPQ: 1
|
IC MPU M683XX 166MHZ 100LQFP
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M683xx | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | M68000 | 3.3V | 1 Core,8/16-Bit | Communications; RISC CPM | DRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 176 MPQ: 1
|
IC MPU MPC82XX 166MHZ 357BGA
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MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core,32-Bit | - | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 36 MPQ: 1
|
IC MPU M680X0 166MHZ 132QFP
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M680x0 | -40°C ~ 85°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | 68020 | 5.0V | 1 Core,32-Bit | - | - | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 36 MPQ: 1
|
IC MPU M680X0 166MHZ 132QFP
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M680x0 | 0°C ~ 70°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | 68020 | 5.0V | 1 Core,32-Bit | - | - | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 166MHZ 480TBGA
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MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 166MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 166MHZ 357BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core,32-Bit | - | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 166MHZ 357BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core,32-Bit | - | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 166MHZ 357BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core,32-Bit | - | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 166MHZ 516BGA
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MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2 | 3.3V | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 166MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 166MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC8XX 166MHZ 256BGA
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MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 1 Core,32-Bit | Communications; CPM | DRAM | 10 Mbps (1) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC8XX 166MHZ 256BGA
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MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 1 Core,32-Bit | Communications; CPM | DRAM | 10 Mbps (1) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 14 MPQ: 1
|
IC MPU M680X0 166MHZ 114PGA
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M680x0 | -40°C ~ 85°C (TA) | 114-BPGA | 114-PGA (34.55x34.55) | 68020 | 5.0V | 1 Core,32-Bit | - | - | - |