Embedded - System On Chip (SoC) - Zui Ai Technology（Taiwan）Company.

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Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Operating Temperature	Package / Case	Supplier Device Package	Architecture	Primary Attributes	Core Processor	Speed	RAM Size	Connectivity
Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Operating Temperature	Package / Case	Supplier Device Package	Architecture	Primary Attributes	Core Processor	Speed	RAM Size	Connectivity
	XCZU17EG-3FFVE1924E	Xilinx Inc.	Inquiry	-	-	IC FPGA 668 I/O 1924FCBGA MOQ: 1 MPQ: 1	IC FPGA 668 I/O 1924FCBGA	0°C ~ 100°C (TJ)	1924-BBGA，FCBGA	1924-FCBGA (45x45)	MCU，FPGA	Zynq®UltraScale+® FPGA，926K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2	600MHz，667MHz，1.5GHz	256kB	CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
	XCZU19EG-2FFVD1760I	Xilinx Inc.	Inquiry	-	-	IC FPGA 308 I/O 1760FCBGA MOQ: 1 MPQ: 1	IC FPGA 308 I/O 1760FCBGA	-40°C ~ 100°C (TJ)	1760-BBGA，FCBGA	1760-FCBGA (42.5x42.5)	MCU，FPGA	Zynq®UltraScale+® FPGA，1143K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2	533MHz，600MHz，1.3GHz	256kB	CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
	XCZU19EG-L2FFVD1760E	Xilinx Inc.	Inquiry	-	-	IC FPGA 308 I/O 1760FCBGA MOQ: 1 MPQ: 1	IC FPGA 308 I/O 1760FCBGA	0°C ~ 100°C (TJ)	1760-BBGA，FCBGA	1760-FCBGA (42.5x42.5)	MCU，FPGA	Zynq®UltraScale+® FPGA，1143K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2	533MHz，600MHz，1.3GHz	256kB	CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
	XCZU19EG-3FFVC1760E	Xilinx Inc.	Inquiry	-	-	IC FPGA 512 I/O 1760FCBGA MOQ: 1 MPQ: 1	IC FPGA 512 I/O 1760FCBGA	0°C ~ 100°C (TJ)	1760-BBGA，FCBGA	1760-FCBGA (42.5x42.5)	MCU，FPGA	Zynq®UltraScale+® FPGA，1143K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2	600MHz，667MHz，1.5GHz	256kB	CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
	XCZU19EG-3FFVE1924E	Xilinx Inc.	Inquiry	-	-	IC FPGA 668 I/O 1924FCBGA MOQ: 1 MPQ: 1	IC FPGA 668 I/O 1924FCBGA	0°C ~ 100°C (TJ)	1924-BBGA，FCBGA	1924-FCBGA (45x45)	MCU，FPGA	Zynq®UltraScale+® FPGA，1143K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2	600MHz，667MHz，1.5GHz	256kB	CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
	XCZU17EG-3FFVD1760E	Xilinx Inc.	Inquiry	-	-	IC FPGA 308 I/O 1760FCBGA MOQ: 1 MPQ: 1	IC FPGA 308 I/O 1760FCBGA	0°C ~ 100°C (TJ)	1760-BBGA，FCBGA	1760-FCBGA (42.5x42.5)	MCU，FPGA	Zynq®UltraScale+® FPGA，926K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2	600MHz，667MHz，1.5GHz	256kB	CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
	XCZU19EG-3FFVD1760E	Xilinx Inc.	Inquiry	-	-	IC FPGA 308 I/O 1760FCBGA MOQ: 1 MPQ: 1	IC FPGA 308 I/O 1760FCBGA	0°C ~ 100°C (TJ)	1760-BBGA，FCBGA	1760-FCBGA (42.5x42.5)	MCU，FPGA	Zynq®UltraScale+® FPGA，1143K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2	600MHz，667MHz，1.5GHz	256kB	CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG

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