- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Architecture：
-
- Primary Attributes：
-
- Core Processor：
-
- RAM Size：
-
- Selected conditions:
Discover 65 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Architecture | Primary Attributes | Core Processor | RAM Size | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Architecture | Primary Attributes | Core Processor | RAM Size | Connectivity | |
|
|
|
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 464 I/O 1517FCBGA
|
Zynq UltraScale+ MPSoC CG | -40°C ~ 100°C (TJ) | 1517-BBGA，FCBGA | 1517-FCBGA (40x40) | MCU，FPGA | Zynq®UltraScale+® FPGA，504K+ Logic Cells | Dual ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 360 I/O 1156FCBGA
|
Zynq UltraScale+ MPSoC CG | -40°C ~ 100°C (TJ) | 1156-BBGA，FCBGA | 1156-FCBGA (35x35) | MCU，FPGA | Zynq®UltraScale+® FPGA，504K+ Logic Cells | Dual ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 328 I/O 1156FCBGA
|
Zynq UltraScale+ MPSoC CG | -40°C ~ 100°C (TJ) | 1156-BBGA，FCBGA | 1156-FCBGA (35x35) | MCU，FPGA | Zynq®UltraScale+® FPGA，599K+ Logic Cells | Dual ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 464 I/O 1517FCBGA
|
Zynq UltraScale+ MPSoC CG | -40°C ~ 100°C (TJ) | 1517-BBGA，FCBGA | 1517-FCBGA (40x40) | MCU，FPGA | Zynq®UltraScale+® FPGA，504K+ Logic Cells | Dual ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
|
|
|
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 328 I/O 1156FCBGA
|
Zynq UltraScale+ MPSoC CG | -40°C ~ 100°C (TJ) | 1156-BBGA，FCBGA | 1156-FCBGA (35x35) | MCU，FPGA | Zynq®UltraScale+® FPGA，599K+ Logic Cells | Dual ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight® | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
