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Discover 2,120 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Architecture | Peripherals | Primary Attributes | Core Processor | Speed | Flash Size | RAM Size | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Architecture | Peripherals | Primary Attributes | Core Processor | Speed | Flash Size | RAM Size | Connectivity | |
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Xilinx Inc. |
152
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3 days |
-
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MOQ: 1 MPQ: 1
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IC FPGA 82 I/O 484FCBGA
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Tray | Zynq UltraScale+ MPSoC EG | -40°C ~ 100°C (TJ) | 484-BBGA，FCBGA | 484-FCBGA (19x19) | MCU，FPGA | DMA，WDT | Zynq®UltraScale+® FPGA，103K+ Logic Cells | Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2 | 500MHz，600MHz，1.2GHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
60
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC FPGA 180 I/O 625FCBGA
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Tray | Zynq UltraScale+ MPSoC EG | -40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | MCU，FPGA | DMA，WDT | Zynq®UltraScale+® FPGA，103K+ Logic Cells | Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2 | 500MHz，600MHz，1.2GHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
60
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3 days |
-
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MOQ: 1 MPQ: 1
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XAZU2EG-L1SFVA625I
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Tray | Zynq UltraScale+ MPSoC EG | -40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | MPU，FPGA | DMA，WDT | Zynq®UltraScale+® FPGA，103K+ Logic Cells | Quad ARM® Cortex®-A9 MPCore® with CoreSight®，Dual ARM® Cortex®-R5 MPCore® with CoreSight® | 500MHz，1.2GHz | - | 1.2MB | CANbus，I2C，SPI，UART/USART，USB | ||
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Xilinx Inc. |
49
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3 days |
-
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MOQ: 1 MPQ: 1
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IC FPGA 252 I/O 784FCBGA
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Tray | Zynq UltraScale+ MPSoC EG | -40°C ~ 100°C (TJ) | 784-BBGA，FCBGA | 784-FCBGA (23x23) | MCU，FPGA | DMA，WDT | Zynq®UltraScale+® FPGA，103K+ Logic Cells | Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2 | 500MHz，600MHz，1.2GHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
60
|
3 days |
-
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MOQ: 1 MPQ: 1
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XAZU2EG-L1SFVC784I
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Tray | Zynq UltraScale+ MPSoC EG | -40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | MPU，FPGA | DMA，WDT | Zynq®UltraScale+® FPGA，154K+ Logic Cells | Quad ARM® Cortex®-A9 MPCore® with CoreSight®，Dual ARM® Cortex®-R5 MPCore® with CoreSight® | 500MHz，1.2GHz | - | 1.2MB | CANbus，I2C，SPI，UART/USART，USB | ||
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Xilinx Inc. |
27
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3 days |
-
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MOQ: 1 MPQ: 1
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IC SOC CORTEX-A9 KINTEX7 900BGA
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Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 900-BBGA，FCBGA | 900-FCBGA (31x31) | MCU，FPGA | DMA | Kintex®-7 FPGA，275K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
26
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3 days |
-
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MOQ: 1 MPQ: 1
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IC SOC CORTEX-A9 KINTEX7 900FBGA
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Tray | Zynq-7000 | 0°C ~ 100°C (TJ) | 900-BBGA，FCBGA | 900-FCBGA (31x31) | MCU，FPGA | DMA | Kintex®-7 FPGA，350K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
44
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3 days |
-
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MOQ: 1 MPQ: 1
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IC SOC CORTEX A-9 ZYNQ7 1156BGA
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Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 1156-BBGA，FCBGA | 1156-FCBGA (35x35) | MCU，FPGA | DMA | Kintex®-7 FPGA，444K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Intel |
52
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC FPGA 224 I/O 672UBGA
|
Tray | Cyclone V SE | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | MCU，FPGA | DMA，POR，WDT | FPGA - 40K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
21
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC SOC CORTEX-A9 KINTEX7 484FBGA
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Tray | Zynq-7000 | 0°C ~ 85°C (TJ) | 484-BBGA，FCBGA | 484-FCBGA (23x23) | MCU，FPGA | DMA | Kintex®-7 FPGA，125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
21
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC SOC CORTEX-A9 KINTEX7 484FBGA
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Tray | Zynq-7000 | 0°C ~ 100°C (TJ) | 484-BBGA，FCBGA | 484-FCBGA (23x23) | MCU，FPGA | DMA | Kintex®-7 FPGA，125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
6
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC SOC CORTEX-A9 KINTEX7 676FBGA
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Tray | Zynq-7000 | 0°C ~ 85°C (TJ) | 676-BBGA，FCBGA | 676-FCBGA (27x27) | MCU，FPGA | DMA | Kintex®-7 FPGA，350K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Xilinx Inc. |
8
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 900FBGA
|
Tray | Zynq-7000 | 0°C ~ 85°C (TJ) | 900-BBGA，FCBGA | 900-FCBGA (31x31) | MCU，FPGA | DMA | Kintex®-7 FPGA，350K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Intel |
17
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Tray | Cyclone V SE | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | MCU，FPGA | DMA，POR，WDT | FPGA - 85K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Intel |
4
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC FPGA 288 I/O 896FBGA
|
Tray | Cyclone V SE | -40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | MCU，FPGA | DMA，POR，WDT | FPGA - 85K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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|
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Xilinx Inc. |
5
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX A-9 ZYNQ7 485BGA
|
Tray | Zynq-7000 | 0°C ~ 100°C (TJ) | 484-FBGA | 485-FBGA (19x19) | MCU，FPGA | DMA | Kintex®-7 FPGA，125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 1GHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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|
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Xilinx Inc. |
3
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 204 I/O 900FCBGA
|
Tray | Zynq UltraScale+ MPSoC CG | 0°C ~ 100°C (TJ) | 900-BBGA，FCBGA | 900-FCBGA (31x31) | MCU，FPGA | DMA，WDT | Zynq®UltraScale+® FPGA，599K+ Logic Cells | Dual ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight® | 500MHz，1.2GHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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|
Xilinx Inc. |
5
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 204 I/O 900FCBGA
|
Tray | Zynq UltraScale+ MPSoC EG | 0°C ~ 100°C (TJ) | 900-BBGA，FCBGA | 900-FCBGA (31x31) | MCU，FPGA | DMA，WDT | Zynq®UltraScale+® FPGA，599K+ Logic Cells | Quad ARM® Cortex®-A53 MPCore® with CoreSight®，Dual ARM®Cortex®-R5 with CoreSight®，ARM Mali®-400 MP2 | 500MHz，600MHz，1.2GHz | - | 256kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Intel |
18
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC FPGA 224 I/O 672UBGA
|
Tray | Cyclone V SX | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | MCU，FPGA | DMA，POR，WDT | FPGA - 40K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG | ||
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Intel |
84
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC FPGA 240 I/O 484UBGA
|
Tray | Cyclone V SE | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) | MCU，FPGA | DMA，POR，WDT | FPGA - 25K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 600MHz | - | 64kB | CANbus，EBI/EMI，Ethernet，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
