Supplier Device Package:
On-State Resistance (Max):
Channel-to-Channel Matching (ΔRon):
Current - Leakage (IS(off)) (Max):
Voltage - Supply, Single (V+):
Voltage - Supply, Dual (V±):
Channel Capacitance (CS(off), CD(off)):
Discover 3 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Package / Case Supplier Device Package On-State Resistance (Max) Channel-to-Channel Matching (ΔRon) Current - Leakage (IS(off)) (Max) Voltage - Supply, Single (V+) Voltage - Supply, Dual (V±) Channel Capacitance (CS(off), CD(off))
HEF4952BT,118
NXP USA Inc.
Inquiry
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MOQ: 2500  MPQ: 1
IC MUX/DEMUX 3X8 16SOIC
Tape & Reel (TR) 16-SOIC (0.154",3.90mm Width) 16-SO 360 Ohm 10 Ohm 200nA 5 V ~ 15 V ±15V 7.5pF
HEF4952BT,112
NXP USA Inc.
Inquiry
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MOQ: 2000  MPQ: 1
IC MUX/DEMUX 3X8 16SOIC
Tube 16-SOIC (0.154",3.90mm Width) 16-SO 360 Ohm 10 Ohm 200nA 5 V ~ 15 V ±15V 7.5pF
MAX14583EEWE+T
Maxim Integrated
Inquiry
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MOQ: 2500  MPQ: 1
IC MUX 8:2 18 OHM 16WLP
Tape & Reel (TR) 16-WFBGA,WLBGA 16-WLP (1.9x1.8) - - - 2.8 V ~ 4.5 V ±2 V ~ 5.5 V -