Supplier Device Package:
-3db Bandwidth:
Channel-to-Channel Matching (ΔRon):
Voltage - Supply, Single (V+):
Voltage - Supply, Dual (V±):
Switch Time (Ton, Toff) (Max):
Discover 3 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Operating Temperature Package / Case Supplier Device Package -3db Bandwidth Channel-to-Channel Matching (ΔRon) Voltage - Supply, Single (V+) Voltage - Supply, Dual (V±) Switch Time (Ton, Toff) (Max)
ADGS1408BCPZ
Analog Devices Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
SPI INTERFACE LOW RON 8:1 MUX,1
Tray -40°C ~ 125°C 24-VFQFN Exposed Pad,CSP 24-LFCSP (4x4) 60MHz 200 mOhm 12V ±15V 165ns,155ns
V62/11612-01XB
Analog Devices Inc.
Inquiry
-
-
MOQ: 0  MPQ: 1
SEMICONDUCTOR OTHER
- -55°C ~ 125°C (TA) 16-TSSOP (0.173",4.40mm Width) 16-TSSOP - 780 mOhm (Max) - - 120ns,120ns
ADGS1408BCPZ-RL7
Analog Devices Inc.
Inquiry
-
-
MOQ: 0  MPQ: 1
SPI INTERFACE LOW RON 8:1 MUX,1
Tape & Reel (TR) -40°C ~ 125°C 24-VFQFN Exposed Pad,CSP 24-LFCSP (4x4) 60MHz 200 mOhm 12V ±15V 165ns,155ns