- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- On-State Resistance (Max):
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- Voltage - Supply, Single (V+):
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- Selected conditions:
Discover 9 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Applications | Operating Temperature | Package / Case | Supplier Device Package | Features | Switch Circuit | On-State Resistance (Max) | Voltage - Supply, Single (V+) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Applications | Operating Temperature | Package / Case | Supplier Device Package | Features | Switch Circuit | On-State Resistance (Max) | Voltage - Supply, Single (V+) | ||
NXP USA Inc. |
4,000
|
3 days |
-
|
MOQ: 4000 MPQ: 1
|
IC USB SWITCH DPDT XQFN10
|
Tape & Reel (TR) | USB | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.4x1.8) | Break-Before-Make,USB 2.0 | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
NXP USA Inc. |
12,809
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT XQFN10
|
Cut Tape (CT) | USB | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.4x1.8) | Break-Before-Make,USB 2.0 | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
NXP USA Inc. |
12,809
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT XQFN10
|
- | USB | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.4x1.8) | Break-Before-Make,USB 2.0 | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC USB 2.0 SWITCH HS 10XQFN
|
Tape & Reel (TR) | USB | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.3x1.6) | Break-Before-Make,USB 2.0 | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
NXP USA Inc. |
3,207
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10XQFN
|
Cut Tape (CT) | USB | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.3x1.6) | Break-Before-Make,USB 2.0 | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
NXP USA Inc. |
3,207
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10XQFN
|
- | USB | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.3x1.6) | Break-Before-Make,USB 2.0 | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC SWITCH TPDT DIFF XQFN24
|
Tape & Reel (TR) | MIPI | -40°C ~ 85°C (TA) | 24-XFQFN | 24-XQFN (2.5x3.4) | Break-Before-Make | 3PDT | 14 Ohm | 2.65 V ~ 4.3 V | ||||
NXP USA Inc. |
712
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC SWITCH TPDT DIFF XQFN24
|
Cut Tape (CT) | MIPI | -40°C ~ 85°C (TA) | 24-XFQFN | 24-XQFN (2.5x3.4) | Break-Before-Make | 3PDT | 14 Ohm | 2.65 V ~ 4.3 V | ||||
NXP USA Inc. |
712
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC SWITCH TPDT DIFF XQFN24
|
- | MIPI | -40°C ~ 85°C (TA) | 24-XFQFN | 24-XQFN (2.5x3.4) | Break-Before-Make | 3PDT | 14 Ohm | 2.65 V ~ 4.3 V |