- Packaging:
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- Series:
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- Voltage - Supply:
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- Package / Case:
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- Supplier Device Package:
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- Standards:
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- Selected conditions:
Discover 14 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Function | Voltage - Supply | Package / Case | Supplier Device Package | Current - Supply | Standards | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Function | Voltage - Supply | Package / Case | Supplier Device Package | Current - Supply | Standards | ||
FTDI,Future Technology Devices International Ltd |
167
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC USB FS I2C 10DFN
|
Tray | USBmadeEZ-FIFO,FT-X,X-Chip | Bridge,USB to I2C | 3.3 V ~ 5 V | 10-WFDFN Exposed Pad | 10-DFN (3x3) | 8mA | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
255
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FIFO 32BIT SYNC UVC 76QFN
|
Tray | - | Bridge,USB to FIFO | 1.8V,2.5V,3.3V | 76-VFQFN Exposed Pad | 76-QFN (9x9) | - | USB 3.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC USB FS I2C 10DFN
|
Tape & Reel (TR) | USBmadeEZ-FIFO,FT-X,X-Chip | Bridge,USB to I2C | 3.3 V ~ 5 V | 10-WFDFN Exposed Pad | 10-DFN (3x3) | 8mA | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
4,016
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC USB FS I2C 10DFN
|
- | USBmadeEZ-FIFO,FT-X,X-Chip | Bridge,USB to I2C | 3.3 V ~ 5 V | 10-WFDFN Exposed Pad | 10-DFN (3x3) | 8mA | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC USB FS I2C 16QFN
|
Tape & Reel (TR) | USBmadeEZ-FIFO,FT-X,X-Chip | Bridge,USB to I2C | 3.3 V ~ 5 V | 16-WQFN Exposed Pad | 16-QFN (4x4) | 8mA | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
6,133
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC USB FS I2C 16QFN
|
Cut Tape (CT) | USBmadeEZ-FIFO,FT-X,X-Chip | Bridge,USB to I2C | 3.3 V ~ 5 V | 16-WQFN Exposed Pad | 16-QFN (4x4) | 8mA | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
6,133
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC USB FS I2C 16QFN
|
- | USBmadeEZ-FIFO,FT-X,X-Chip | Bridge,USB to I2C | 3.3 V ~ 5 V | 16-WQFN Exposed Pad | 16-QFN (4x4) | 8mA | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 980 MPQ: 1
|
IC USB FS I2C 16QFN
|
Tray | USBmadeEZ-FIFO,FT-X,X-Chip | Bridge,USB to I2C | 3.3 V ~ 5 V | 16-WQFN Exposed Pad | 16-QFN (4x4) | 8mA | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC BRIDGE USB TO I2C/SPI 32VQFN
|
Tape & Reel (TR) | - | Bridge,USB to I2C/SPI | 1.8V,2.5V,3.3V | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | - | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC BRIDGE USB TO I2C/SPI 32VQFN
|
Cut Tape (CT) | - | Bridge,USB to I2C/SPI | 1.8V,2.5V,3.3V | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | - | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC BRIDGE USB TO I2C/SPI 32VQFN
|
- | - | Bridge,USB to I2C/SPI | 1.8V,2.5V,3.3V | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | - | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC BRIDGE USB TO I2C/SPI 32VQFN
|
Tape & Reel (TR) | - | Bridge,USB to I2C/SPI | 1.8V,2.5V,3.3V | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | - | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC BRIDGE USB TO I2C/SPI 32VQFN
|
Cut Tape (CT) | - | Bridge,USB to I2C/SPI | 1.8V,2.5V,3.3V | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | - | USB 2.0 | ||||
FTDI,Future Technology Devices International Ltd |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC BRIDGE USB TO I2C/SPI 32VQFN
|
- | - | Bridge,USB to I2C/SPI | 1.8V,2.5V,3.3V | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | - | USB 2.0 |