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Discover 29 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Data Rate | Duplex | Receiver Hysteresis | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Data Rate | Duplex | Receiver Hysteresis | ||
Infineon Technologies |
5,000
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC TXRX HIGH-END LIN 8DSOP
|
Tape & Reel (TR) | -40°C ~ 150°C | 8-SOIC (0.154",3.90mm Width) | PG-DSO-8-16 | 20kbps | - | 120mV | ||||
Infineon Technologies |
6,133
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX HIGH-END LIN 8DSOP
|
Cut Tape (CT) | -40°C ~ 150°C | 8-SOIC (0.154",3.90mm Width) | PG-DSO-8-16 | 20kbps | - | 120mV | ||||
Infineon Technologies |
6,133
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX HIGH-END LIN 8DSOP
|
- | -40°C ~ 150°C | 8-SOIC (0.154",3.90mm Width) | PG-DSO-8-16 | 20kbps | - | 120mV | ||||
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 6000 MPQ: 1
|
IC TXRX LIN 8HVSON
|
Tape & Reel (TR) | - | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | Full | 175mV | ||||
NXP USA Inc. |
11,512
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.1 SAE J2602 8HVSON
|
Cut Tape (CT) | - | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | Full | 175mV | ||||
NXP USA Inc. |
11,512
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.1 SAE J2602 8HVSON
|
- | - | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | Full | 175mV | ||||
NXP USA Inc. |
40,000
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC TXRX LIN 2.0/SAE J2602 8-SOIC
|
Tape & Reel (TR) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | Full | 175mV | ||||
NXP USA Inc. |
41,018
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.0/SAE J2602 8-SOIC
|
Cut Tape (CT) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | Full | 175mV | ||||
NXP USA Inc. |
41,018
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.0/SAE J2602 8-SOIC
|
- | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | Full | 175mV | ||||
NXP USA Inc. |
12,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC TXRX LIN 2.1/SAE J2602 8-SOIC
|
Tape & Reel (TR) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | Full | 175mV | ||||
NXP USA Inc. |
15,867
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.1/SAE J2602 8SOIC
|
Cut Tape (CT) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | Full | 175mV | ||||
NXP USA Inc. |
15,867
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.1/SAE J2602 8SOIC
|
- | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | Full | 175mV | ||||
Infineon Technologies |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC TXRX HIGH-END LIN 8TSON
|
Tape & Reel (TR) | -40°C ~ 150°C | 8-TDFN Exposed Pad | PG-TSON-8-1 | 20kbps | - | 120mV | ||||
Infineon Technologies |
5,376
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX HIGH-END LIN 8TSON
|
Cut Tape (CT) | -40°C ~ 150°C | 8-TDFN Exposed Pad | PG-TSON-8-1 | 20kbps | - | 120mV | ||||
Infineon Technologies |
5,376
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX HIGH-END LIN 8TSON
|
- | -40°C ~ 150°C | 8-TDFN Exposed Pad | PG-TSON-8-1 | 20kbps | - | 120mV | ||||
NXP USA Inc. |
7,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC TRANSCEIVER LIN 8SOIC
|
Tape & Reel (TR) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | - | - | ||||
NXP USA Inc. |
9,273
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TRANSCEIVER LIN 8SOIC
|
Cut Tape (CT) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | Full | 175mV | ||||
NXP USA Inc. |
9,273
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TRANSCEIVER LIN 8SOIC
|
- | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | Full | 175mV | ||||
NXP USA Inc. |
2,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC TRANSCEIVER LIN 8SOIC
|
Tape & Reel (TR) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | - | - | ||||
NXP USA Inc. |
2,652
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TRANSCEIVER LIN 8SOIC
|
Cut Tape (CT) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | - | - |