- Manufacturer：
-
- Voltage - Supply：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Mounting Type：
-
- Memory Size：
-
- Clock Frequency：
-
- Access Time：
-
- Write Cycle Time - Word, Page：
-
- Selected conditions:
Discover 532 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Clock Frequency | Access Time | Write Cycle Time - Word, Page | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Memory Size | Clock Frequency | Access Time | Write Cycle Time - Word, Page | |
|
|
|
Alliance Memory，Inc. |
701
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 60FPBGA
|
Tray | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TJ) | 60-TFBGA | 60-FPBGA (8x9) | Surface Mount | 256Mb (16M x 16) | 166MHz | - | 15ns | ||
|
|
|
Micron Technology Inc. |
17,277
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 60VFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-VFBGA | 60-VFBGA (8x9) | Surface Mount | 512Mb (32M x 16) | 200MHz | 5.0ns | 15ns | ||
|
|
|
Winbond Electronics |
2,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 512M PARALLEL 90VFBGA
|
Tape & Reel (TR) | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | Surface Mount | 512Mb (16M x 32) | 200MHz | 5ns | 15ns | ||
|
|
|
Winbond Electronics |
2,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 90VFBGA
|
Cut Tape (CT) | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | Surface Mount | 512Mb (16M x 32) | 200MHz | 5ns | 15ns | ||
|
|
|
Winbond Electronics |
2,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 90VFBGA
|
- | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | Surface Mount | 512Mb (16M x 32) | 200MHz | 5ns | 15ns | ||
|
|
|
Winbond Electronics |
2,215
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 90VFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-VFBGA (8x13) | Surface Mount | 512Mb (16M x 32) | 200MHz | 5ns | 15ns | ||
|
|
|
Winbond Electronics |
2,207
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 60VFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TC) | 60-TFBGA | 60-VFBGA (8x9) | Surface Mount | 1Gb (64M x 16) | 200MHz | 5ns | 15ns | ||
|
|
|
Micron Technology Inc. |
3,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
IC DRAM 1G PARALLEL 60VFBGA
|
Tape & Reel (TR) | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-VFBGA | 60-VFBGA (8x9) | Surface Mount | 1Gb (64M x 16) | 200MHz | 5.0ns | 15ns | ||
|
|
|
Micron Technology Inc. |
3,784
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 60VFBGA
|
Cut Tape (CT) | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-VFBGA | 60-VFBGA (8x9) | Surface Mount | 1Gb (64M x 16) | 200MHz | 5.0ns | 15ns | ||
|
|
|
Micron Technology Inc. |
3,784
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 60VFBGA
|
- | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-VFBGA | 60-VFBGA (8x9) | Surface Mount | 1Gb (64M x 16) | 200MHz | 5.0ns | 15ns | ||
|
|
|
Micron Technology Inc. |
1,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
IC DRAM 2G PARALLEL 60VFBGA
|
Tape & Reel (TR) | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-VFBGA | 60-VFBGA (8x9) | Surface Mount | 2Gb (128M x 16) | 208MHz | 5.0ns | 14.4ns | ||
|
|
|
Micron Technology Inc. |
1,644
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 60VFBGA
|
Cut Tape (CT) | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-VFBGA | 60-VFBGA (8x9) | Surface Mount | 2Gb (128M x 16) | 208MHz | 5.0ns | 14.4ns | ||
|
|
|
Micron Technology Inc. |
1,644
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 60VFBGA
|
- | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-VFBGA | 60-VFBGA (8x9) | Surface Mount | 2Gb (128M x 16) | 208MHz | 5.0ns | 14.4ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
205
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 60TFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-TFBGA | 60-TFBGA (8x10) | Surface Mount | 512Mb (32M x 16) | 166MHz | 5.5ns | 12ns | ||
|
|
|
ISSI，Integrated Silicon Solution Inc |
234
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 90TFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-TFBGA (8x13) | Surface Mount | 512Mb (16M x 32) | 166MHz | 5.5ns | 12ns | ||
|
|
|
Winbond Electronics |
245
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 60VFBGA
|
Tray | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 60-TFBGA | 60-VFBGA (8x9) | Surface Mount | 128Mb (8M x 16) | 200MHz | 5ns | 15ns | ||
|
|
|
Winbond Electronics |
212
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 60VFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-TFBGA | 60-VFBGA (8x9) | Surface Mount | 128Mb (8M x 16) | 200MHz | 5ns | 15ns | ||
|
|
|
Winbond Electronics |
164
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-VFBGA (8x13) | Surface Mount | 256Mb (8M x 32) | 200MHz | 5ns | 15ns | ||
|
|
|
Winbond Electronics |
151
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tray | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | Surface Mount | 256Mb (8M x 32) | 200MHz | 5ns | 15ns | ||
|
|
|
Winbond Electronics |
318
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 60VFBGA
|
Tray | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-TFBGA | 60-VFBGA (8x9) | Surface Mount | 512Mb (32M x 16) | 200MHz | 5ns | 15ns |
