Packaging:
Series:
Operating Temperature:
Access Time:
Memory Interface:
Write Cycle Time - Word, Page:
Discover 14 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Voltage - Supply Operating Temperature Memory Size Access Time Memory Interface Write Cycle Time - Word, Page
TC58NVG1S3HBAI4
Toshiba Memory America,Inc.
26
3 days
-
MOQ: 1  MPQ: 1
IC FLASH 2G PARALLEL 63TFBGA
Tray - 2.7 V ~ 3.6 V -40°C ~ 85°C (TA) 2Gb (256M x 8) 25ns Parallel 25ns
TC58NVG0S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FLASH 1G PARALLEL 63TFBGA
Tray - 2.7 V ~ 3.6 V -40°C ~ 85°C (TA) 1Gb (128M x 8) 25ns Parallel 25ns
TC58NVG2S0HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FLASH 4G PARALLEL 63TFBGA
Tray - 2.7 V ~ 3.6 V -40°C ~ 85°C (TA) 4Gb (512M x 8) 25ns Parallel 25ns
TC58BVG0S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
IC FLASH 1G PARALLEL 63TFBGA
Tray Benand 2.7 V ~ 3.6 V -40°C ~ 85°C (TA) 1Gb (128M x 8) 25ns Parallel 25ns
TC58BVG2S0HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
IC FLASH 4G PARALLEL 63TFBGA
Tray Benand 2.7 V ~ 3.6 V -40°C ~ 85°C (TA) 4Gb (512M x 8) 25ns Parallel 25ns
TC58BYG0S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
1GB SLC NAND BGA 24NM I TEMP (EE
- Benand 1.7 V ~ 1.95 V -40°C ~ 85°C (TA) 1Gb (128M x 8) - - 25ns
TC58BVG1S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
2GB SLC BENAND 24NM BGA 9X11 (EE
- Benand 2.7 V ~ 3.6 V -40°C ~ 85°C (TA) 2Gb (256M x 8) - - 25ns
TC58BYG1S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
2GB SLC NAND BGA 24NM I TEMP (EE
- Benand 1.7 V ~ 1.95 V -40°C ~ 85°C (TA) 2Gb (256M x 8) - - 25ns
TC58NYG1S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
2G NAND SLC 24NM BGA
- - 1.7 V ~ 1.95 V -40°C ~ 85°C (TA) 2Gb (256M x 8) - - 25ns
TC58NYG2S0HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
4GB SLC NAND 24NM BGA 9X11 1.8V
- - 1.7 V ~ 1.95 V -40°C ~ 85°C (TA) 4Gb (512M x 8) - - 25ns
TH58BVG2S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
4GB SLC BENAND 24NM BGA 9X11 (EE
- Benand 2.7 V ~ 3.6 V -40°C ~ 85°C (TA) 4Gb (512M x 8) - - 25ns
TH58BYG2S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
4G SLC NAND BGA 24NM
- Benand - -40°C ~ 85°C 4Gb (512M x 8) - - -
TH58NYG2S3HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
4GB SLC NAND 24NM BGA 9X11 1.8V
- - 1.7 V ~ 1.95 V -40°C ~ 85°C (TA) 4Gb (512M x 8) - - 25ns
TH58NVG3S0HBAI4
Toshiba Memory America,Inc.
Inquiry
-
-
MOQ: 210  MPQ: 1
8GB SLC NAND 24NM BGA 9X11 3.3V
- - 2.7 V ~ 3.6 V -40°C ~ 85°C (TA) 8Gb (1G x 8) - - 25ns