Discover 149 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Applications Voltage - Supply Operating Temperature Package / Case Current - Supply
MC33FS6522LAE
NXP USA Inc.
195
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC34SB0410AE
NXP USA Inc.
471
3 days
-
MOQ: 1  MPQ: 1
IC MOTOR DRIVER 36V 48LQFP
Tray Pump,Valve Controller 6 V ~ 36 V -40°C ~ 125°C 48-LQFP Exposed Pad -
MC33FS6500NAE
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS6510NAE
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 1.5A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS6520NAE
NXP USA Inc.
238
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS4500CAE
NXP USA Inc.
160
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP LINEAR 0.5A V
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS6500CAE
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS6500LAE
NXP USA Inc.
240
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS6520CAE
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC35FS6500NAE
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
FS6500
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 150°C (TA) 48-LQFP Exposed Pad -
MC33FS6521NAE
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS6502CAE
NXP USA Inc.
150
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS4502LAE
NXP USA Inc.
240
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP LINEAR 0.5A V
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC35FS6500CAE
NXP USA Inc.
218
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 150°C (TA) 48-LQFP Exposed Pad -
MC33FS6502LAE
NXP USA Inc.
123
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC33FS6523CAE
NXP USA Inc.
144
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad -
MC35FS4503CAE
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP,LINEAR 0.5A V
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 150°C (TA) 48-LQFP Exposed Pad -
MC35FS6513CAE
NXP USA Inc.
180
3 days
-
MOQ: 1  MPQ: 1
SBC,DCDC 1.5A VCORE FS1B CAN,15
Tray System Basis Chip -1.0 V ~ 40 V -40°C ~ 150°C (TA) 48-LQFP Exposed Pad -
MC34FS6407NAE
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
IC SYSTEM BASIS CHIP CAN 48LQFP
Tray System Basis Chip 2.7 V ~ 36 V -40°C ~ 125°C 48-LQFP Exposed Pad 13mA
MC34FS6408NAE
NXP USA Inc.
217
3 days
-
MOQ: 1  MPQ: 1
IC SYSTEM BASIS CHIP CAN 48LQFP
Tray System Basis Chip 2.7 V ~ 36 V -40°C ~ 125°C 48-LQFP Exposed Pad 13mA