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Discover 91 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Applications | Voltage - Supply | Operating Temperature | Package / Case | Current - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Applications | Voltage - Supply | Operating Temperature | Package / Case | Current - Supply | |
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Microchip Technology |
137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC ULTRASOUND DRIVER 40WQFN
|
Tray | Pulse Generator | 2.5V | - | 40-WFQFN Exposed Pad | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 days |
-
|
MOQ: 3000 MPQ: 1
|
IC PMIC REG BUCK/LDO 40QFN
|
Tape & Reel (TR) | - | - | - | 40-VFQFN Exposed Pad | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC PMIC REG BUCK/LDO 40QFN
|
Cut Tape (CT) | - | - | - | 40-VFQFN Exposed Pad | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC PMIC REG BUCK/LDO 40QFN
|
- | - | - | - | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
PF1510
|
Tape & Reel (TR) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
Cut Tape (CT) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
- | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
PF1510
|
Tape & Reel (TR) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
Cut Tape (CT) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
- | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
PF1510
|
Tape & Reel (TR) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
Cut Tape (CT) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
- | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
PF1510
|
Tape & Reel (TR) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
Cut Tape (CT) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
- | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
PF1510
|
Tape & Reel (TR) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
Cut Tape (CT) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PF1510
|
- | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 105°C | 40-VFQFN Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
POWER MANAGEMENT IC: 3 BUCK REGS
|
Tape & Reel (TR) | Embedded Systems，Low-Power IoT，Mobile/Wearable Devices | 3.8 V ~ 7 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | - |
