- Voltage - Supply：
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- Package / Case：
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- Supplier Device Package：
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- Output Type：
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- Accuracy：
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Discover 51 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Voltage - Supply | Package / Case | Supplier Device Package | Output Type | Topology | Accuracy | Output Fan | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Voltage - Supply | Package / Case | Supplier Device Package | Output Type | Topology | Accuracy | Output Fan | |
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR SPD EEPROM 8TDFN
|
Tape & Reel (TR) | 2.2 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | I2C | ADC (Sigma Delta)，EEPROM，Register Bank | ±3°C(Max) | Yes | |||
|
|
Microchip Technology |
4,707
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR SPD EEPROM 8TDFN
|
Cut Tape (CT) | 2.2 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | I2C | ADC (Sigma Delta)，EEPROM，Register Bank | ±3.5°C(Max) | Yes | |||
|
|
Microchip Technology |
4,707
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR SPD EEPROM 8TDFN
|
- | 2.2 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | I2C | ADC (Sigma Delta)，EEPROM，Register Bank | ±3.5°C(Max) | Yes | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-TDFN
|
Tape & Reel (TR) | 2.7 V ~ 5.5 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
5,470
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-TDFN
|
Cut Tape (CT) | 2.7 V ~ 5.5 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
5,470
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-TDFN
|
- | 2.7 V ~ 5.5 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
2,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 3V 2WIRE 8-TSSOP
|
Tube | 2.7 V ~ 5.5 V | 8-TSSOP (0.173"，4.40mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
1,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 3V 2WIRE 8-DFN
|
Tube | 2.7 V ~ 5.5 V | 8-VFDFN Exposed Pad | 8-DFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
2,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-TSSOP
|
Tape & Reel (TR) | 2.7 V ~ 5.5 V | 8-TSSOP (0.173"，4.40mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-UDFN
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 8-UFDFN Exposed Pad | 8-UDFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | Yes | |||
|
|
Microchip Technology |
3,259
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-UDFN
|
Cut Tape (CT) | 3 V ~ 3.6 V | 8-UFDFN Exposed Pad | 8-UDFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | Yes | |||
|
|
Microchip Technology |
3,259
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-UDFN
|
- | 3 V ~ 3.6 V | 8-UFDFN Exposed Pad | 8-UDFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | Yes | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC TEMP SENSOR DGTL 8TSSOP
|
Tape & Reel (TR) | 2.7 V ~ 5.5 V | 8-TSSOP (0.173"，4.40mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-DFN
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 8-VFDFN Exposed Pad | 8-DFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | Yes | |||
|
|
Microchip Technology |
1,117
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-DFN
|
Cut Tape (CT) | 3 V ~ 3.6 V | 8-VFDFN Exposed Pad | 8-DFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | Yes | |||
|
|
Microchip Technology |
1,117
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-DFN
|
- | 3 V ~ 3.6 V | 8-VFDFN Exposed Pad | 8-DFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | Yes | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-DFN
|
Tape & Reel (TR) | 2.7 V ~ 5.5 V | 8-VFDFN Exposed Pad | 8-DFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
3,073
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-DFN
|
Cut Tape (CT) | 2.7 V ~ 5.5 V | 8-VFDFN Exposed Pad | 8-DFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
3,073
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-DFN
|
- | 2.7 V ~ 5.5 V | 8-VFDFN Exposed Pad | 8-DFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | No | |||
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-TDFN
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | Yes |
