Discover 17 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Package / Case Supplier Device Package Output Type Accuracy
SE97BTP,547
NXP USA Inc.
Inquiry
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MOQ: 4000  MPQ: 1
IC TEMP SENSOR DIMM 8HWSON
Tape & Reel (TR) 8-WFDFN Exposed Pad 8-HWSON (2x3) I2C/SMBus ±3°C(Max)
SE97BTP,547
NXP USA Inc.
2,987
3 days
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MOQ: 1  MPQ: 1
IC TEMP SENSOR DIMM 8HWSON
Cut Tape (CT) 8-WFDFN Exposed Pad 8-HWSON (2x3) I2C/SMBus ±3°C(Max)
SE97BTP,547
NXP USA Inc.
2,987
3 days
-
MOQ: 1  MPQ: 1
IC TEMP SENSOR DIMM 8HWSON
- 8-WFDFN Exposed Pad 8-HWSON (2x3) I2C/SMBus ±3°C(Max)
SE97PW,118
NXP USA Inc.
Inquiry
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MOQ: 2500  MPQ: 1
IC TEMP SENSOR DIMM 8-TSSOP
Tape & Reel (TR) 8-TSSOP,8-MSOP (0.118",3.00mm Width) 8-TSSOP I2C/SMBus ±3°C(Max)
SE97PW,118
NXP USA Inc.
Inquiry
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MOQ: 1  MPQ: 1
IC TEMP SENSOR DIMM 8-TSSOP
Cut Tape (CT) 8-TSSOP,8-MSOP (0.118",3.00mm Width) 8-TSSOP I2C/SMBus ±3°C(Max)
SE97PW,118
NXP USA Inc.
Inquiry
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MOQ: 1  MPQ: 1
IC TEMP SENSOR DIMM 8-TSSOP
- 8-TSSOP,8-MSOP (0.118",3.00mm Width) 8-TSSOP I2C/SMBus ±3°C(Max)
SE97TK,118
NXP USA Inc.
Inquiry
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MOQ: 6000  MPQ: 1
IC TEMP SENSOR DIMM 8-HVSON
Tape & Reel (TR) 8-VFDFN Exposed Pad 8-HVSON (3x3) I2C/SMBus ±3°C(Max)
SE97TK,118
NXP USA Inc.
Inquiry
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MOQ: 1  MPQ: 1
IC TEMP SENSOR DIMM 8-HVSON
Cut Tape (CT) 8-VFDFN Exposed Pad 8-HVSON (3x3) I2C/SMBus ±3°C(Max)
SE97TP,147
NXP USA Inc.
Inquiry
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MOQ: 4000  MPQ: 1
IC TEMP SENSOR DIMM 3.3V 8-HWSON
Tape & Reel (TR) 8-WFDFN Exposed Pad 8-HWSON (2x3) 2-Wire Serial,I2C/SMBUS ±3°C
SE97TP,147
NXP USA Inc.
Inquiry
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MOQ: 1  MPQ: 1
IC TEMP SENSOR DIMM 3.3V 8-HWSON
Cut Tape (CT) 8-WFDFN Exposed Pad 8-HWSON (2x3) 2-Wire Serial,I2C/SMBUS ±3°C
SE97TP,147
NXP USA Inc.
Inquiry
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MOQ: 1  MPQ: 1
IC TEMP SENSOR DIMM 3.3V 8-HWSON
- 8-WFDFN Exposed Pad 8-HWSON (2x3) 2-Wire Serial,I2C/SMBUS ±3°C
SE97TL,147
NXP USA Inc.
Inquiry
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MOQ: 4000  MPQ: 1
IC TEMP SENSOR DDR 3.3V 8-HXSON
Tape & Reel (TR) 8-XFDFN Exposed Pad 8-HXSON (2x3) I2C/SMBus ±3°C(Max)
SE97TL,147
NXP USA Inc.
Inquiry
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MOQ: 1  MPQ: 1
IC TEMP SENSOR DDR 3.3V 8-HXSON
Cut Tape (CT) 8-XFDFN Exposed Pad 8-HXSON (2x3) I2C/SMBus ±3°C(Max)
SE97TL,147
NXP USA Inc.
Inquiry
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MOQ: 1  MPQ: 1
IC TEMP SENSOR DDR 3.3V 8-HXSON
- 8-XFDFN Exposed Pad 8-HXSON (2x3) I2C/SMBus ±3°C(Max)
SE97TL,128
NXP USA Inc.
Inquiry
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MOQ: 3000  MPQ: 1
IC TEMP SENSOR DIMM 3.3V 8-HXSON
Tape & Reel (TR) 8-XFDFN Exposed Pad 8-HXSON (2x3) I2C/SMBus ±3°C(Max)
SE97TP,128
NXP USA Inc.
Inquiry
-
-
MOQ: 3000  MPQ: 1
IC TEMP SENSOR DIMM 3.3V 8-HWSON
Tape & Reel (TR) 8-WFDFN Exposed Pad 8-HWSON (2x3) 2-Wire Serial,I2C/SMBUS ±3°C
SE97TP/S900,547
NXP USA Inc.
Inquiry
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MOQ: 4000  MPQ: 1
IC TEMP SENSOR DIMM 3.3V 8-HWSON
Tape & Reel (TR) 8-WFDFN Exposed Pad 8-HWSON (2x3) 2-Wire Serial,I2C/SMBUS ±3°C