- Packaging：
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- Voltage - Supply：
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Discover 33 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Function | Voltage - Supply | Package / Case | Supplier Device Package | Output Type | Topology | Accuracy | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Function | Voltage - Supply | Package / Case | Supplier Device Package | Output Type | Topology | Accuracy | |
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NXP USA Inc. |
72,000
|
3 days |
-
|
MOQ: 4000 MPQ: 1
|
IC TEMP SENSOR DDR 8-HWSON
|
Tape & Reel (TR) | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
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|
|
NXP USA Inc. |
74,656
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DDR 8-HWSON
|
Cut Tape (CT) | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
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|
|
NXP USA Inc. |
74,656
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DDR 8-HWSON
|
- | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 4000 MPQ: 1
|
IC TEMP SENSOR DIMM 8HWSON
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Tape & Reel (TR) | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | I2C/SMBus | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | ||
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|
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NXP USA Inc. |
2,987
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 8HWSON
|
Cut Tape (CT) | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | I2C/SMBus | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | ||
|
|
|
NXP USA Inc. |
2,987
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 8HWSON
|
- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | I2C/SMBus | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC TEMP SENSOR I2C 8TSSOP
|
Tape & Reel (TR) | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
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|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR I2C 8TSSOP
|
Cut Tape (CT) | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR I2C 8TSSOP
|
- | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC TEMP SENSOR I2C 8HVSON
|
Tape & Reel (TR) | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-VFDFN Exposed Pad | 8-HVSON (3x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR I2C 8HVSON
|
Cut Tape (CT) | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-VFDFN Exposed Pad | 8-HVSON (3x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR I2C 8HVSON
|
- | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | 8-VFDFN Exposed Pad | 8-HVSON (3x3) | I2C/SMBus | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC TEMP SENSOR DIMM 8-TSSOP
|
Tape & Reel (TR) | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 8-TSSOP
|
Cut Tape (CT) | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 8-TSSOP
|
- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-TSSOP | I2C/SMBus | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC TEMP SENSOR DIMM 8-HVSON
|
Tape & Reel (TR) | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-VFDFN Exposed Pad | 8-HVSON (3x3) | I2C/SMBus | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 8-HVSON
|
Cut Tape (CT) | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-VFDFN Exposed Pad | 8-HVSON (3x3) | I2C/SMBus | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC TEMP SENSOR DIMM 3.3V 8-HWSON
|
Tape & Reel (TR) | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | 2-Wire Serial，I2C/SMBUS | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 3.3V 8-HWSON
|
Cut Tape (CT) | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | 2-Wire Serial，I2C/SMBUS | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 3.3V 8-HWSON
|
- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | 2-Wire Serial，I2C/SMBUS | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C |
