Discover 7 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Voltage - Supply Package / Case Supplier Device Package Frequency Current - Supply Gain Noise Figure RF Type Test Frequency
BGM15LA12E6327XTSA1
Infineon Technologies
4,500
3 days
-
MOQ: 1  MPQ: 1
IC AMP MMIC 12ATSLP
Tape & Reel (TR) 2.2 V ~ 3.3 V 12-UFQFN Exposed Pad ATSLP-12-3 700MHz ~ 1GHz 4.9mA 17.5dB 1.1dB LTE,W-CDMA -
BGA736L16E6327XTSA1
Infineon Technologies
7,500
3 days
-
MOQ: 1  MPQ: 1
IC AMP MMIC 3.6V TSLP-16
Tape & Reel (TR) 2.7 V ~ 3 V 16-XFQFN Exposed Pad TSLP-16-1 800MHz,900MHz,1.8GHz,1.9GHz,2.1GHz 5.3mA 16.1dB 7.8dB W-CDMA,HSPDA 1.9GHz
BGA736L16E6327XTSA1
Infineon Technologies
7,500
3 days
-
MOQ: 1  MPQ: 1
IC AMP MMIC 3.6V TSLP-16
Cut Tape (CT) 2.7 V ~ 3 V 16-XFQFN Exposed Pad TSLP-16-1 800MHz,900MHz,1.8GHz,1.9GHz,2.1GHz 5.3mA 16.1dB 7.8dB W-CDMA,HSPDA 1.9GHz
BGA736L16E6327XTSA1
Infineon Technologies
7,500
3 days
-
MOQ: 1  MPQ: 1
IC AMP MMIC 3.6V TSLP-16
- 2.7 V ~ 3 V 16-XFQFN Exposed Pad TSLP-16-1 800MHz,900MHz,1.8GHz,1.9GHz,2.1GHz 5.3mA 16.1dB 7.8dB W-CDMA,HSPDA 1.9GHz
BGA777L7E6327XTSA1
Infineon Technologies
Inquiry
-
-
MOQ: 1  MPQ: 1
IC AMP MMIC SGL-BAND LN TSLP7-1
Tape & Reel (TR) 2.6 V ~ 3 V 6-XFDFN Exposed Pad TSLP-7-1 2.3GHz,2.7GHz 10mA 16.8dB 1.2dB UMTS 2.3GHz
BGA777L7E6327XTSA1
Infineon Technologies
Inquiry
-
-
MOQ: 1  MPQ: 1
IC AMP MMIC SGL-BAND LN TSLP7-1
Cut Tape (CT) 2.6 V ~ 3 V 6-XFDFN Exposed Pad TSLP-7-1 2.3GHz,2.7GHz 10mA 16.8dB 1.2dB UMTS 2.3GHz
BGA777L7E6327XTSA1
Infineon Technologies
Inquiry
-
-
MOQ: 1  MPQ: 1
IC AMP MMIC SGL-BAND LN TSLP7-1
- 2.6 V ~ 3 V 6-XFDFN Exposed Pad TSLP-7-1 2.3GHz,2.7GHz 10mA 16.8dB 1.2dB UMTS 2.3GHz