Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Voltage - Supply Package / Case Supplier Device Package Current - Supply Gain P1dB RF Type Test Frequency
BGM15HA12E6327XTSA1
Infineon Technologies
Inquiry
-
-
MOQ: 1  MPQ: 1
IC AMP MMIC 12ATSLP
Tape & Reel (TR) 2.2 V ~ 3.3 V 12-UFQFN Exposed Pad ATSLP-12-3 4.9mA 16.3dB -8dBm LTE,W-CDMA -
BGM15HA12E6327XTSA1
Infineon Technologies
4,498
3 days
-
MOQ: 1  MPQ: 1
IC AMP MMIC 12ATSLP
Cut Tape (CT) 2.2 V ~ 3.3 V 12-UFQFN Exposed Pad ATSLP-12-3 5.9mA 16.3dB - W-CDMA 2.3GHz ~ 2.7GHz
BGM15HA12E6327XTSA1
Infineon Technologies
4,498
3 days
-
MOQ: 1  MPQ: 1
IC AMP MMIC 12ATSLP
- 2.2 V ~ 3.3 V 12-UFQFN Exposed Pad ATSLP-12-3 5.9mA 16.3dB - W-CDMA 2.3GHz ~ 2.7GHz
BGA777N7E6327XTSA1
Infineon Technologies
Inquiry
-
-
MOQ: 1  MPQ: 1
IC AMP SI-MMIC
Tape & Reel (TR) 2.6 V ~ 3 V 6-XFDFN Exposed Pad TSNP-7-1 4.2mA 16dB - UMTS 2.3GHz ~ 2.7MHz
BGA777N7E6327XTSA1
Infineon Technologies
7,060
3 days
-
MOQ: 1  MPQ: 1
IC AMP SI-MMIC
Cut Tape (CT) 2.6 V ~ 3 V 6-XFDFN Exposed Pad TSNP-7-1 4.2mA 16dB - UMTS 2.3GHz ~ 2.7MHz
BGA777N7E6327XTSA1
Infineon Technologies
7,060
3 days
-
MOQ: 1  MPQ: 1
IC AMP SI-MMIC
- 2.6 V ~ 3 V 6-XFDFN Exposed Pad TSNP-7-1 4.2mA 16dB - UMTS 2.3GHz ~ 2.7MHz