- Type:
-
- Inner Dimension:
-
- Thermal Center Pad:
-
- Selected conditions:
Discover 2 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Number of Positions | Inner Dimension | Thermal Center Pad | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Number of Positions | Inner Dimension | Thermal Center Pad | ||
Chip Quik Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TO-263-9 STENCIL
|
TO/DDPAK | 9 | 0.400" L x 0.390" W (10.16mm x 9.91mm) | 0.370" L x 0.427" W (9.40mm x 10.85mm) | ||||
Chip Quik Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DFN-8/MOS-8 (0.97MM PITCH,3.94X
|
DFN | 8 | 0.155" L x 0.093" W (3.94mm x 2.36mm) | - |