- Inner Dimension：
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- Thermal Center Pad：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Number of Positions | Pitch | Inner Dimension | Thermal Center Pad | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Number of Positions | Pitch | Inner Dimension | Thermal Center Pad | |
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Chip Quik Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HSOP-30 STENCIL
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30 | 0.031" (0.80mm) | 0.630" L x 0.433" W (16.00mm x 11.00mm) | 0.270" L x 0.630" W (6.85mm x 16.00mm) | ||
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Chip Quik Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HSOP-44 STENCIL
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44 | 0.026" (0.65mm) | 0.630" L x 0.433" W (16.00mm x 11.00mm) | 0.270" L x 0.630" W (6.85mm x 16.00mm) | ||
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Chip Quik Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HSOP-44 STENCIL
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44 | 0.026" (0.65mm) | 0.630" L x 0.433" W (16.00mm x 11.00mm) | - | ||
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Chip Quik Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HSOP-48 STENCIL
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48 | 0.026" (0.65mm) | 0.630" L x 0.346" W (16.00mm x 8.80mm) | - |
