573300D00000G

Description :
TOP MOUNT HEATSINK .4" D2PAK
Attachment Method :
SMD Pad
Diameter :
-
Height Off Base (Height of Fin) :
0.400" (10.16mm)
Length :
0.500" (12.70mm)
Material :
Copper
Material Finish :
Tin
Package Cooled :
TO-263 (D2Pak)
Power Dissipation @ Temperature Rise :
1.3W @ 30°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
8.00°C/W @ 300 LFM
Thermal Resistance @ Natural :
18.00°C/W
Type :
Top Mount
Width :
1.030" (26.16mm)

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