QB2010B60ESTB

Attachment Method :

SMD Pad

Diameter :

-

Height Off Base (Height of Fin) :

0.060" (1.52mm)

Length :

0.195" (4.95mm)

Material :

Beryllium Oxide Ceramic

Material Finish :

-

Package Cooled :

-

Power Dissipation @ Temperature Rise :

-

Series :

Q-Bridge

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

6.00°C/W

Type :

Heat Spreader

Width :

0.095" (2.41mm)