Bergquist

HF115AC-0.0055-AC-90

Description :
THERM PAD TO-218 W/ADH HI-FLOW
Adhesive :
Adhesive - One Side
Backing,Carrier :
Fiberglass
Color :
Gray
Material :
Phase Change Compound
Outline :
21.84mm x 18.79mm
Series :
Hi-Flow 115-AC
Shape :
Rectangle
Thermal Conductivity :
0.8 W/m-K
Thermal Resistivity :
0.35°C/W
Thickness :
0.0055" (0.140mm)
Usage :
TO-218,TO-220,TO-247

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