Microsemi Corporation

A2F060M3E-FGG256M

Description :
IC FPGA 60K GATES 128KB 256FBGA
Package :
256-FBGA (17x17)
Architecture :
MCU,FPGA
Connectivity :
EBI/EMI,I2C,SPI,UART/USART
Core Processor :
ARM® Cortex®-M3
Flash Size :
128KB
Operating Temperature :
-55°C ~ 125°C (TJ)
Package / Case :
256-LBGA
Packaging :
Tray
Peripherals :
DMA,POR,WDT
Primary Attributes :
ProASIC®3 FPGA,60K Gates,1536D-Flip-Flops
RAM Size :
16kB
Series :
SmartFusion
Speed :
80MHz
Supplier Device Package :
256-FBGA (17x17)

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