D10850-40T5

Description :
HEATSINK 128PQFP COMPOSITE
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.400" (10.16mm)
Length :
0.850" (21.59mm)
Material :
Composite
Material Finish :
-
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
2.5W @ 90°C
Series :
Deltem
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
20.00°C/W @ 100 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount
Width :
0.850" (21.59mm)

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