LTN20069
- Description :
- HEAT SINK BGA/PGA 16.5X16.5X8.9
- This part is RoHS compliant
- Datasheet (1)
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- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.350" (8.89mm)
- Length :
- 0.650" (16.51mm)
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Power Dissipation @ Temperature Rise :
- -
- Series :
- Penguin
- Shape :
- Square, Fins
- Thermal Resistance @ Forced Air Flow :
- 8.00°C/W @ 500 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Board Level
- Width :
- 0.653" (16.59mm)