Wakefield-Vette

LTN20069

Description :
HEAT SINK BGA/PGA 16.5X16.5X8.9
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.350" (8.89mm)
Length :
0.650" (16.51mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Series :
Penguin
Shape :
Square, Fins
Thermal Resistance @ Forced Air Flow :
8.00°C/W @ 500 LFM
Thermal Resistance @ Natural :
-
Type :
Board Level
Width :
0.653" (16.59mm)

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