Xilinx Inc.

XC7Z007S-2CLG225I

Description :
IC FPGA SOC 100I/O 225BGA
Package :
225-CSPBGA (13x13)
Architecture :
MCU,FPGA
Connectivity :
CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
Core Processor :
Single ARM® Cortex®-A9 MPCore® with CoreSight®
Flash Size :
-
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
225-LFBGA,CSPBGA
Packaging :
Tray
Peripherals :
DMA
Primary Attributes :
Artix®-7 FPGA,23K Logic Cells
RAM Size :
256kB
Series :
Zynq-7000
Speed :
766MHz
Supplier Device Package :
225-CSPBGA (13x13)

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