XCZU2EG-3SFVC784E

Description :
IC FPGA 252 I/O 784FCBGA
Package :
784-FCBGA (23x23)
Architecture :
MCU,FPGA
Connectivity :
CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
Core Processor :
Quad ARM® Cortex®-A53 MPCore® with CoreSight®,Dual ARM®Cortex®-R5 with CoreSight®,ARM Mali®-400 MP2
Flash Size :
-
Operating Temperature :
0°C ~ 100°C (TJ)
Package / Case :
784-BBGA,FCBGA
Packaging :
Tray
Peripherals :
DMA,WDT
Primary Attributes :
Zynq®UltraScale+® FPGA,103K+ Logic Cells
RAM Size :
256kB
Series :
Zynq UltraScale+ MPSoC EG
Speed :
600MHz,667MHz,1.5GHz
Supplier Device Package :
784-FCBGA (23x23)

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