- Manufacturer:
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- Operating Temperature:
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- Number of Positions:
-
- Contact Finish:
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- Housing Material:
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- Actuator Material:
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Discover 89 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Features | Number of Positions | Contact Finish | Housing Material | Actuator Material | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Features | Number of Positions | Contact Finish | Housing Material | Actuator Material | ||
Molex,LLC |
2,588
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 20POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 20 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 26POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 26 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
4,118
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 26POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 26 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
4,118
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 26POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 26 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Tape & Reel (TR) | -25°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 8 | Tin Bismuth | Polyamide (PA46),Nylon 4/6 | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
1,307
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Cut Tape (CT) | -25°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 8 | Tin Bismuth | Polyamide (PA46),Nylon 4/6 | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 18POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 18 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
1,740
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 18POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 18 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
1,740
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 18POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 18 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 28POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 28 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
1,014
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 28POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 28 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
1,014
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 28POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 28 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Tape & Reel (TR) | -25°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA46),Nylon 4/6 | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
172
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Cut Tape (CT) | -25°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA46),Nylon 4/6 | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
172
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
- | -25°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA46),Nylon 4/6 | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 14POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 14 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
630
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 14POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 14 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
630
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 14POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 14 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex Connector Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Tape & Reel (TR) | -25°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 12 | Tin Bismuth | Polyamide (PA46),Nylon 4/6 | Polyphenylene Sulfide (PPS) | ||||
Molex Connector Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 14POS 0.50MM R/A
|
Tape & Reel (TR) | -25°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 14 | Tin Bismuth | Polyamide (PA46),Nylon 4/6 | Polyphenylene Sulfide (PPS) |