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Discover 283 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
78
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3 days |
-
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MOQ: 1 MPQ: 1
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PH3 101.6X25.4X0.21MM
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PH3 | Heat Spreader | Copper | 4.000" (101.60mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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Advanced Thermal Solutions Inc. |
970
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STEEL W/TAB
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- | Board Level, Vertical | Steel | 0.787" (20.00mm) | 1.220" (30.99mm) | PC Pin | TO-220 | 0.032" (0.80mm) | - | 13.00°C/W @ 200 LFM | 25.00°C/W | Tin | |||
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CUI Inc. |
988
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level | Aluminum Alloy | 0.984" (25.00mm) | 0.625" (16.00mm) | Bolt On | TO-220 | 0.354" (9.00mm) | 3.8W @ 75°C | 6.12°C/W @ 200 LFM | 19.74°C/W | Black Anodized | ||
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American Technical Ceramics |
Inquiry
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-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
320
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3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
320
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3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
1,000
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3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.050" (1.27mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 10.00°C/W | - | ||
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American Technical Ceramics |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.050" (1.27mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 10.00°C/W | - | ||
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American Technical Ceramics |
1,000
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3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.050" (1.27mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 10.00°C/W | - | ||
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Aavid, Thermal Division of Boyd Corporation |
10
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3 days |
-
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MOQ: 1 MPQ: 1
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60340 EXTRUSION 1.312X6.437"X4
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- | Top Mount | Aluminum | 48.000" (1219.20mm) | - | Adhesive | - | 1.312" (33.32mm) | - | - | - | - | |||
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American Technical Ceramics |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | 32.00°C/W | - | ||
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American Technical Ceramics |
956
|
3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | 32.00°C/W | - | ||
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American Technical Ceramics |
956
|
3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | 32.00°C/W | - | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
65
|
3 days |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
65
|
3 days |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
737
|
3 days |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
737
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 25.00°C/W | - | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 16.00°C/W | - |
