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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Discover 283 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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American Technical Ceramics |
818
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3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 16.00°C/W | - | ||
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American Technical Ceramics |
818
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 16.00°C/W | - | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 21.00°C/W | - | ||
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American Technical Ceramics |
835
|
3 days |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 21.00°C/W | - | ||
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American Technical Ceramics |
835
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.020" (0.51mm) | - | - | 21.00°C/W | - | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | 21.00°C/W | - | ||
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American Technical Ceramics |
990
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | 21.00°C/W | - | ||
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American Technical Ceramics |
990
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | 21.00°C/W | - | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 10.00°C/W | - | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 10.00°C/W | - | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 10.00°C/W | - | ||
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t-Global Technology |
51
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X12.07X0.062MM
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PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
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t-Global Technology |
21
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X12.07X0.07MM
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PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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t-Global Technology |
49
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X19.1X0.062MM
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PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 0.750" (19.05mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
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t-Global Technology |
11
|
3 days |
-
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MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.07MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 0.750" (19.05mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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t-Global Technology |
44
|
3 days |
-
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MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.07MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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t-Global Technology |
24
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3 76.2X12.07X0.21MM
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PH3 | Heat Spreader | Copper | 3.000" (76.20mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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t-Global Technology |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.062MM
|
PH3n | Heat Spreader | Copper | 4.000" (101.60mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
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t-Global Technology |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.07MM
|
PH3n | Heat Spreader | Copper | 4.000" (101.60mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
|
|
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t-Global Technology |
20
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X25.4X0.21MM
|
PH3 | Heat Spreader | Copper | 3.000" (76.20mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester |
