Thermal - Heat Sinks - Zui Ai Technology（Taiwan）Company.

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Package Cooled：

Height Off Base (Height of Fin)：

Power Dissipation @ Temperature Rise：

Thermal Resistance @ Natural：

Material Finish：

Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Type	Material	Shape	Length	Width	Diameter	Attachment Method	Package Cooled	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Natural	Material Finish
Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Type	Material	Shape	Length	Width	Diameter	Attachment Method	Package Cooled	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Natural	Material Finish
	V7236B1	ASSMANN WSW Components	5,932	3 days	-	HEATSINK TO-220 19.05X13.21MM MOQ: 1 MPQ: 1	HEATSINK TO-220 19.05X13.21MM	-	Board Level	Aluminum	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	Bolt On	TO-220	0.375" (9.52mm)	-	24.00°C/W	Black Anodized
	XL25-10-10-2	t-Global Technology	5,067	3 days	-	XL25 CERAMIC BOARD 10X10X2MM MOQ: 1 MPQ: 1	XL25 CERAMIC BOARD 10X10X2MM	XL-25	Heat Spreader	Ceramic	Square	0.393" (10.00mm)	0.393" (10.00mm)	-	-	Assorted (BGA, LGA, CPU, ASIC...)	0.079" (2.00mm)	-	-	-
	XLI98-10-2.25-P	t-Global Technology	2,715	3 days	-	XL25 CERAMIC 10X10MM W/LI98C ADH MOQ: 1 MPQ: 1	XL25 CERAMIC 10X10MM W/LI98C ADH	XL-25	Heat Spreader	Ceramic	Square	0.393" (10.00mm)	0.393" (10.00mm)	-	Thermal Tape, Adhesive (Included)	Assorted (BGA, LGA, CPU, ASIC...)	0.089" (2.25mm)	-	-	-
	V-1100-SMD/A-L	ASSMANN WSW Components	1,010	3 days	-	HEATSINK TO-263 12.70X26.20MM MOQ: 1 MPQ: 1	HEATSINK TO-263 12.70X26.20MM	-	Top Mount	Copper	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	SMD Pad	TO-263 (D2Pak)	0.390" (9.91mm)	-	23.00°C/W	Tin
	XL25-20-20-2	t-Global Technology	5,198	3 days	-	XL25 CERAMIC BOARD 20X20X2MM MOQ: 1 MPQ: 1	XL25 CERAMIC BOARD 20X20X2MM	XL-25	Heat Spreader	Ceramic	Square	0.787" (20.00mm)	0.787" (20.00mm)	-	-	Assorted (BGA, LGA, CPU, ASIC...)	0.079" (2.00mm)	-	-	-
	V5618B	ASSMANN WSW Components	1,169	3 days	-	HEATSINK ALUM ANOD MOQ: 1 MPQ: 1	HEATSINK ALUM ANOD	-	Top Mount	Aluminum	Rectangular, Fins	0.748" (19.00mm)	0.250" (6.35mm)	-	Press Fit	14-DIP and 16-DIP	0.189" (4.80mm)	-	46.00°C/W	Black Anodized
	V5629W220	ASSMANN WSW Components	9,032	3 days	-	HEATSINK ALUM ANOD MOQ: 1 MPQ: 1	HEATSINK ALUM ANOD	-	Board Level, Vertical	Aluminum	Rectangular, Fins	0.984" (25.00mm)	0.448" (11.40mm)	-	Bolt On and PC Pin	TO-220	0.260" (6.60mm)	-	36.00°C/W	Black Anodized
	V7700W	ASSMANN WSW Components	3,658	3 days	-	HEATSINK ALUM ANOD MOQ: 1 MPQ: 1	HEATSINK ALUM ANOD	-	Board Level, Vertical	Aluminum	Rectangular, Fins	0.984" (25.00mm)	0.625" (16.00mm)	-	Bolt On	SOT-32, TO-220	0.630" (16.00mm)	-	9.00°C/W	Black Anodized
	XLI98-20-2.25-P	t-Global Technology	4,024	3 days	-	XL25 CERAMIC 20X20MM W/LI98C ADH MOQ: 1 MPQ: 1	XL25 CERAMIC 20X20MM W/LI98C ADH	XL-25	Heat Spreader	Ceramic	Square	0.787" (20.00mm)	0.787" (20.00mm)	-	Thermal Tape, Adhesive (Included)	Assorted (BGA, LGA, CPU, ASIC...)	0.089" (2.25mm)	-	-	-
	CSM221-12AE	Ohmite	1,270	3 days	-	HEATSINK BLACK ANODIZED MOQ: 1 MPQ: 1	HEATSINK BLACK ANODIZED	CSM	Board Level, Vertical	Aluminum	Rectangular, Fins	0.472" (12.00mm)	0.492" (12.50mm)	-	Solderable Feet	TO-220	1.228" (31.20mm)	2.0W @ 44°C	18.00°C/W	Black Anodized
	V5618C	ASSMANN WSW Components	2,946	3 days	-	HEATSINK ALUM ANOD MOQ: 1 MPQ: 1	HEATSINK ALUM ANOD	-	Top Mount	Aluminum	Rectangular, Fins	0.900" (23.00mm)	0.250" (6.35mm)	-	Press Fit	18-DIP	0.189" (4.80mm)	-	40.00°C/W	Black Anodized
	V6560X	ASSMANN WSW Components	1,376	3 days	-	HEATSINK ALUM ANOD MOQ: 1 MPQ: 1	HEATSINK ALUM ANOD	-	Board Level	Aluminum	Rectangular, Fins	1.476" (37.50mm)	1.181" (30.00mm)	-	Bolt On and PC Pin	TO-220	0.472" (12.00mm)	-	8.00°C/W	Black Anodized
	V5629G	ASSMANN WSW Components	2,442	3 days	-	HEATSINK ALUM ANOD MOQ: 1 MPQ: 1	HEATSINK ALUM ANOD	-	Board Level	Aluminum	Rectangular, Fins	0.984" (25.00mm)	0.472" (12.00mm)	-	Bolt On	TO-220	0.256" (6.50mm)	-	40.00°C/W	Black Anodized
	V5220W	ASSMANN WSW Components	1,562	3 days	-	HEATSINK ANOD ALUM W/PIN TO-220 MOQ: 1 MPQ: 1	HEATSINK ANOD ALUM W/PIN TO-220	-	Board Level, Vertical	Aluminum	Rectangular, Fins	0.984" (25.00mm)	1.260" (32.00mm)	-	Bolt On	TO-220	0.787" (19.99mm)	-	10.00°C/W	Black Anodized
	TG-CJ-LI-12-12-10-PF	t-Global Technology	4,065	3 days	-	HEATSINK CER 12X12X10MM W/TAPE MOQ: 1 MPQ: 1	HEATSINK CER 12X12X10MM W/TAPE	-	Heat Spreader	Ceramic	Square, Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	Thermal Tape, Adhesive (Included)	-	0.394" (10.00mm)	-	-	-
	V4330N	ASSMANN WSW Components	3,125	3 days	-	HEATSINK ANOD ALUM TO-220 MOQ: 1 MPQ: 1	HEATSINK ANOD ALUM TO-220	-	Top Mount	Aluminum	Rectangular, Fins	0.787" (20.00mm)	1.142" (29.00mm)	-	Bolt On	TO-220	0.472" (12.00mm)	-	12.00°C/W	Black Anodized
	V6560Y	ASSMANN WSW Components	6,178	3 days	-	HEATSINK ALUM ANOD MOQ: 1 MPQ: 1	HEATSINK ALUM ANOD	-	Board Level	Aluminum	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	Bolt On and PC Pin	TO-220	0.472" (12.00mm)	-	7.00°C/W	Black Anodized
	V8511W	ASSMANN WSW Components	1,377	3 days	-	HEATSINK ALUM ANOD MOQ: 1 MPQ: 1	HEATSINK ALUM ANOD	-	Board Level, Vertical	Aluminum	Rectangular, Fins	1.000" (25.40mm)	1.638" (41.60mm)	-	Bolt On and PC Pin	SOT-32, TO-220, TOP-3	0.984" (25.00mm)	-	6.50°C/W	Black Anodized
	V8813X	ASSMANN WSW Components	1,723	3 days	-	HEATSINK TO-220/TOP-3/SOT-32 MOQ: 1 MPQ: 1	HEATSINK TO-220/TOP-3/SOT-32	-	Board Level, Vertical	Aluminum	Rectangular, Fins	1.496" (38.00mm)	1.359" (34.50mm)	-	Bolt On and PC Pin	SOT-32, TO-220, TOP-3	0.492" (12.50mm)	-	5.00°C/W	Black Anodized
	PB1-36CB	CTS Thermal Management Products	3,257	3 days	-	HEATSINK VERT .50"H BLK TO-220 MOQ: 1 MPQ: 1	HEATSINK VERT .50"H BLK TO-220	PB1-36	Board Level, Vertical	Aluminum	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	Bolt On and PC Pin	TO-126, TO-127, TO-220	0.500" (12.70mm)	1.0W @ 70°C	20.00°C/W	Black Anodized

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