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Discover 293 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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NXP USA Inc. |
500
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3 days |
-
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MOQ: 500 MPQ: 1
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IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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Texas Instruments |
2,874
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3 days |
-
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MOQ: 1 MPQ: 1
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SITARA PROCESSOR
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Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | Yes | HDMI | 10/100/1000 Mbps (1) | USB 2.0 (1)，USB 3.0 (1) | - | ||
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Texas Instruments |
246
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3 days |
-
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MOQ: 1 MPQ: 1
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SITARA PROCESSOR
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Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | No | - | 10/100/1000 Mbps (1) | USB 2.0 (1)，USB 3.0 (1) | - | ||
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Texas Instruments |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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IC MPU OMAP-L1X 375MHZ 361NFBGA
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Tape & Reel (TR) | OMAP-L1x | -40°C ~ 105°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 375MHz | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | LPDDR，DDR2 | No | LCD | 10/100 Mbps (1) | USB 1.1 + PHY (1)，USB 2.0 + PHY (1) | Boot Security，Cryptography | ||
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Texas Instruments |
1,159
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU OMAP-L1X 375MHZ 361NFBGA
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Cut Tape (CT) | OMAP-L1x | -40°C ~ 105°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 375MHz | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | LPDDR，DDR2 | No | LCD | 10/100 Mbps (1) | USB 1.1 + PHY (1)，USB 2.0 + PHY (1) | Boot Security，Cryptography | ||
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Texas Instruments |
1,159
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU OMAP-L1X 375MHZ 361NFBGA
|
- | OMAP-L1x | -40°C ~ 105°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 375MHz | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | LPDDR，DDR2 | No | LCD | 10/100 Mbps (1) | USB 1.1 + PHY (1)，USB 2.0 + PHY (1) | Boot Security，Cryptography | ||
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Texas Instruments |
1,776
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU OMAP-L1X 345MHZ 361NFBGA
|
Tube | OMAP-L1x | -55°C ~ 125°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 345MHz | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | SDRAM | No | LCD | 10/100 Mbps (1) | USB 1.1 + PHY (1)，USB 2.0 + PHY (1) | Boot Security，Cryptography | ||
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NXP USA Inc. |
59
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6QP ENHAN 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
500
|
3 days |
-
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MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
60
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
66
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
46
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP ENHAN 624FCBGA
|
Tray | i.MX6QP | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
68
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 1GHZ 624FCBGA
|
Tray | i.MX6DP | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
31
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 852MHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
87
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
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NXP USA Inc. |
76
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6DP 852MHZ 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
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NXP USA Inc. |
28
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 852MHZ 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 600MHZ DDR3L
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 600MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | - | GbE (2) | USB 2.0 (1) | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
Tray | QorIQ Layerscape | 0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 800MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | - | GbE (3) | USB 2.0 (1)，USB 3.0 + PHY | Secure Boot，TrustZone® |
