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Discover 6,346 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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Texas Instruments |
2,811
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU SITARA 800MHZ 324NFBGA
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Tray | Sitara | -40°C ~ 105°C (TJ) | 324-LFBGA | 324-NFBGA(15x15) | ARM® Cortex®-A8 | 1.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2，DDR3，DDR3L | Yes | LCD，Touchscreen | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
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NXP USA Inc. |
2,652
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 400MHZ 473MAPBGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
990
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
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NXP USA Inc. |
453
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 417MHZ 489BGA
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Tray | MPC83XX | -40°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 417MHz | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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|
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NXP USA Inc. |
265
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
1,520
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
|
NXP USA Inc. |
1,129
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
230
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
1,424
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
564
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
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NXP USA Inc. |
1,173
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
596
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 333MHz | 1 Core，32-Bit | - | DDR，DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
1,825
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
446
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
Texas Instruments |
1,817
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-35XX 600MHZ 515FCBGA
|
Tray | OMAP-35xx | 0°C ~ 90°C (TJ) | 515-VFBGA，FCBGA | 515-POP-FCBGA (12x12) | ARM® Cortex®-A8 | 1.8V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR | No | LCD | - | - | USB 1.x (3)，USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
911
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,680
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 1.0GHZ 529TEBGA-2
|
Tray | i.MX53 | -20°C ~ 85°C (TC) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
292
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
499
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
133
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 333MHz | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography |
