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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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Discover 27 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 days |
-
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MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
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- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
9,699
|
3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
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- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
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- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Ohmite |
9,471
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263 BLACK
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D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Ohmite |
3,336
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263
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D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Ohmite |
1,763
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268 BLACK
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D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.220" (30.99mm) | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
1,458
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TRIPLE TO-126 COPPER
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- | Board Level, Vertical | Copper | 1.759" (44.68mm) | 1.750" (44.45mm) | Clip and Board Mounts | TO-126 | - | 6.50°C/W @ 200 LFM | 15.00°C/W | Tin | |||
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Advanced Thermal Solutions Inc. |
938
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-252 D-PAK COPPER
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- | Top Mount | Copper | 0.315" (8.00mm) | 0.842" (21.40mm) | - | TO-252 (DPAK) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | Tin | |||
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Apex Microtechnology |
12
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR DK AND HQ PACKAGES
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Apex Precision Power | Board Level | Aluminum | 1.500" (38.10mm) | 0.400" (10.16mm) | Bolt On | - | - | - | 16.00°C/W | - | ||
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Apex Microtechnology |
31
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT
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Apex Precision Power | Top Mount | Copper | 0.500" (12.70mm) | 1.220" (30.99mm) | SMD Pad | SMD | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
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Ohmite |
5
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268
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D | Top Mount | Aluminum | 0.500" (12.70mm) | 1.220" (30.99mm) | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
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Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO220 HOR MNT W/TAB
|
- | Board Level | Aluminum | 0.742" (18.85mm) | 0.860" (21.84mm) | Bolt On | TO-220 | - | 11.00°C/W @ 200 LFM | 23.20°C/W | Black Anodized | |||
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Wakefield-Vette |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK
|
231 | Board Level, Vertical | Aluminum | 0.690" (17.53mm) | 0.835" (21.21mm) | Bolt On and PC Pin | TO-220 | 2.0W @ 45°C | 8.00°C/W @ 400 LFM | - | Pre-Black Anodized | |||
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Wakefield-Vette |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT BLK
|
231 | Board Level, Vertical | Aluminum | 0.690" (17.53mm) | 0.835" (21.21mm) | Bolt On and Board Mounts | TO-220 | 2.0W @ 45°C | 8.00°C/W @ 400 LFM | - | Black Anodized | |||
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CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-252, 8 X
|
- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPAK) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | ||
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Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM BLACK SMD
|
218 | Top Mount | Copper | 0.320" (8.13mm) | 0.900" (22.86mm) | SMD Pad | SMD | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Tin |
