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- Series：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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Discover 11 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
|
- | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
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3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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- | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D2Pak) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
9,699
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3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
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- | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
|
- | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Apex Microtechnology |
31
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT
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Apex Precision Power | 0.500" (12.70mm) | 1.220" (30.99mm) | SMD | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM BLACK SMD
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218 | 0.320" (8.13mm) | 0.900" (22.86mm) | SMD | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Tin | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM NATURAL SMD
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218 | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | 31.00°C/W | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.9X8X10.2MM
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- | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin |
