- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
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Wakefield-Vette |
2,632
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
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655 | 1.600" (40.64mm) | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | 0.522" (13.27mm) | 4.0W @ 40°C | ||
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Wakefield-Vette |
4,378
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | 0.650" (16.51mm) | 3.0W @ 20°C | ||
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Wakefield-Vette |
Inquiry
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | 0.650" (16.51mm) | 3.0W @ 20°C |
