- Manufacturer：
-
- Shape：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Selected conditions:
Discover 16 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
2,632
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 40.6MM SQ H=.525"
|
655 | Top Mount | Square, Pin Fins | 1.600" (40.64mm) | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,329
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 12W H=1.25" BLK
|
- | Board Level | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 5.00°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
4,378
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,586
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 1.75" HIGH RISE TO-220
|
- | Board Level, Vertical | Rectangular, Fins | 1.750" (44.45mm) | 0.750" (19.05mm) | Clip and Board Mounts | TO-220 | 1.750" (44.45mm) | 4.0W @ 30°C | 6.30°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,820
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN 38.1MM
|
- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 40°C | 5.50°C/W | Black Anodized | ||
|
|
|
Ohmite |
137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 TO-264 BLK
|
M | Top Mount | Rectangular, Fins | 2.170" (55.12mm) | 1.350" (34.30mm) | Clip and PC Pin | TO-247, TO-264 | 1.520" (38.61mm) | 16.0W @ 43°C | - | Black Anodized | ||
|
|
|
Ohmite |
159
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 TO-264
|
M | Top Mount | Rectangular, Fins | 2.170" (55.12mm) | 1.350" (34.30mm) | Clip and PC Pin | TO-247, TO-264 | 1.520" (38.61mm) | 16.0W @ 43°C | - | Degreased | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
66365 EXTRUSION 0.63X1.5"X4
|
- | Top Mount | Rectangular, Pin Fins | 48.000" (1219.20mm) | 1.500" (38.10mm) | Adhesive | - | 0.630" (16.00mm) | - | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 PIN BLACK
|
- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 30°C | 4.40°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGER-SHAPED-HEATSINK 8K/W
|
- | Board Level | Rectangular, Fins | 1.880" (47.75mm) | 1.400" (35.56mm) | Bolt On | - | 1.250" (31.75mm) | 1.0W @ 10°C | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On | TO-220 | 1.000" (25.40mm) | 6.0W @ 40°C | 5.50°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Square, Angled Fins | 1.750" (44.45mm) | 0.490" (12.44mm) | Bolt On and Board Mounts | TO-220, TO-218 | 1.750" (44.45mm) | 4.0W @ 30°C | 6.30°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 1.220" (31.00mm) | 4.0W @ 30°C | 6.60°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Rhombus | 1.550" (39.37mm) | 1.550" (39.37mm) | Bolt On | TO-3 | 1.750" (44.45mm) | 10.0W @ 50°C | 4.50°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Rhombus | 1.550" (39.37mm) | 1.550" (39.37mm) | Bolt On | TO-3 | 1.500" (38.10mm) | 6.0W @ 30°C | 4.80°C/W | Black Anodized |
