Power Dissipation @ Temperature Rise:
Discover 61 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Shape Length Width Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
V2017B
ASSMANN WSW Components
25,551
3 days
-
MOQ: 1  MPQ: 1
HEATSINK ANOD ALUM CPU
- Top Mount Square, Pin Fins 0.393" (10.00mm) 0.393" (10.00mm) - 0.275" (7.00mm) - - 31.00°C/W
LTN20069
Wakefield-Vette
38,100
3 days
-
MOQ: 1  MPQ: 1
HEAT SINK BGA/PGA 16.5X16.5X8.9
Penguin Board Level Square, Fins 0.650" (16.51mm) 0.653" (16.59mm) Thermal Tape, Adhesive (Included) 0.350" (8.89mm) - 8.00°C/W @ 500 LFM -
655-53AB
Wakefield-Vette
2,632
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 40.6MM SQ H=.525"
655 Top Mount Square, Pin Fins 1.600" (40.64mm) 1.600" (40.64mm) Thermal Tape, Adhesive (Not Included) 0.522" (13.27mm) 4.0W @ 40°C 2.00°C/W @ 400 LFM -
BDN09-3CB/A01
CTS Thermal Management Products
3,997
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE .91"SQ
BDN Top Mount Square, Pin Fins 0.910" (23.11mm) 0.910" (23.11mm) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) - 9.60°C/W @ 400 LFM 26.90°C/W
BDN11-3CB/A01
CTS Thermal Management Products
2,354
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.11"SQ
BDN Top Mount Square, Pin Fins 1.110" (28.19mm) 1.110" (28.19mm) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) - 7.20°C/W @ 400 LFM 20.90°C/W
APF19-19-06CB
CTS Thermal Management Products
1,686
3 days
-
MOQ: 1  MPQ: 1
HEATSINK LOW-PROFILE FORGED
APF Top Mount Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) Thermal Tape, Adhesive (Not Included) 0.250" (6.35mm) - 7.10°C/W @ 200 LFM -
APF19-19-13CB/A01
CTS Thermal Management Products
4,900
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/ADHESIVE TAPE
APF Top Mount Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) Thermal Tape, Adhesive (Included) 0.500" (12.70mm) - 4.00°C/W @ 200 LFM -
APF19-19-06CB/A01
CTS Thermal Management Products
3,861
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/ADHESIVE TAPE
APF Top Mount Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) Thermal Tape, Adhesive (Included) 0.250" (6.35mm) - 7.10°C/W @ 200 LFM -
APF19-19-10CB/A01
CTS Thermal Management Products
1,900
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/ADHESIVE TAPE
APF Top Mount Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) Thermal Tape, Adhesive (Included) 0.370" (9.40mm) - 5.30°C/W @ 200 LFM -
APF30-30-13CB/A01
CTS Thermal Management Products
3,956
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/ADHESIVE TAPE
APF Top Mount Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) Thermal Tape, Adhesive (Included) 0.500" (12.70mm) - 2.50°C/W @ 200 LFM -
APF30-30-06CB/A01
CTS Thermal Management Products
475
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/ADHESIVE TAPE
APF Top Mount Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) Thermal Tape, Adhesive (Included) 0.250" (6.35mm) - 4.40°C/W @ 200 LFM -
APF40-40-06CB
CTS Thermal Management Products
199
3 days
-
MOQ: 1  MPQ: 1
HEATSINK LOW-PROFILE FORGED
APF Top Mount Square, Fins 1.575" (40.01mm) 1.575" (40.01mm) Thermal Tape, Adhesive (Not Included) 0.250" (6.35mm) - 3.30°C/W @ 200 LFM -
APF40-40-10CB
CTS Thermal Management Products
969
3 days
-
MOQ: 1  MPQ: 1
HEATSINK LOW-PROFILE FORGED
APF Top Mount Square, Fins 1.575" (40.01mm) 1.575" (40.01mm) Thermal Tape, Adhesive (Not Included) 0.370" (9.40mm) - 2.50°C/W @ 200 LFM -
APF40-40-06CB/A01
CTS Thermal Management Products
657
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/ADHESIVE TAPE
APF Top Mount Square, Fins 1.575" (40.01mm) 1.575" (40.01mm) Thermal Tape, Adhesive (Included) 0.250" (6.35mm) - 3.30°C/W @ 200 LFM -
628-65AB
Wakefield-Vette
4,378
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.65"
628 Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Not Included) 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM -
BDN14-3CB/A01
CTS Thermal Management Products
1,776
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.41"SQ
BDN Top Mount Square, Pin Fins 1.410" (35.81mm) 1.410" (35.81mm) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) - 5.60°C/W @ 400 LFM 16.20°C/W
BDN12-3CB/A01
CTS Thermal Management Products
192
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.21"SQ
BDN Top Mount Square, Pin Fins 1.210" (30.73mm) 1.210" (30.73mm) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) - 6.80°C/W @ 400 LFM 19.60°C/W
BDN12-5CB/A01
CTS Thermal Management Products
661
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.21"SQ
BDN Top Mount Square, Pin Fins 1.210" (30.73mm) 1.210" (30.73mm) Thermal Tape, Adhesive (Included) 0.555" (14.10mm) - 5.20°C/W @ 400 LFM 16.50°C/W
BDN13-3CB/A01
CTS Thermal Management Products
652
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.31"SQ
BDN Top Mount Square, Pin Fins 1.310" (33.27mm) 1.310" (33.27mm) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) - 6.00°C/W @ 400 LFM 16.10°C/W
BDN18-6CB/A01
CTS Thermal Management Products
377
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.81"SQ
BDN Top Mount Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) Thermal Tape, Adhesive (Included) 0.605" (15.37mm) - 2.80°C/W @ 400 LFM 8.10°C/W