Thermal - Heat Sinks - Zui Ai Technology（Taiwan）Company.

Series：

Type：

Shape：

Length：

Width：

Diameter：

Attachment Method：

Height Off Base (Height of Fin)：

Power Dissipation @ Temperature Rise：

Thermal Resistance @ Forced Air Flow：

Thermal Resistance @ Natural：

Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Type	Shape	Length	Width	Diameter	Attachment Method	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural
Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Type	Shape	Length	Width	Diameter	Attachment Method	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural
	500403B00000G	Aavid, Thermal Division of Boyd Corporation	2,329	3 days	-	HEATSINK TO-3 12W H=1.25" BLK MOQ: 1 MPQ: 1	HEATSINK TO-3 12W H=1.25" BLK	-	Board Level	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	Bolt On	1.250" (31.75mm)	10.0W @ 50°C	2.00°C/W @ 400 LFM	5.00°C/W
	641K	Wakefield-Vette	321	3 days	-	HEATSINK TO-3 HORZ MT NO HOLES MOQ: 1 MPQ: 1	HEATSINK TO-3 HORZ MT NO HOLES	641	Board Level	Rectangular, Angled Fins	3.000" (76.20mm)	4.125" (104.77mm)	-	Press Fit	1.000" (25.40mm)	15.0W @ 36°C	0.90°C/W @ 250 LFM	2.40°C/W
	HS09	Apex Microtechnology	688	3 days	-	HEATSINK TO3 MOQ: 1 MPQ: 1	HEATSINK TO3	Apex Precision Power	Board Level	Rhombus	1.630" (41.40mm)	1.290" (32.77mm)	-	Bolt On	0.750" (19.05mm)	7.0W @ 80°C	14.00°C/W @ 200 LFM	11.70°C/W
	HS01	Apex Microtechnology	422	3 days	-	HEATSINK TOP MT TO-3 MOQ: 1 MPQ: 1	HEATSINK TOP MT TO-3	Apex Precision Power	Top Mount	Rhombus	1.600" (40.64mm)	1.000" (25.40mm)	-	Bolt On	1.000" (25.40mm)	1.5W @ 20°C	2.00°C/W @ 600 LFM	11.60°C/W
	HS02	Apex Microtechnology	381	3 days	-	HEATSINK 8P TO-3 4.5C/W MOQ: 1 MPQ: 1	HEATSINK 8P TO-3 4.5C/W	Apex Precision Power	Board Level	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	Bolt On	1.500" (38.10mm)	10.0W @ 50°C	2.00°C/W @ 300 LFM	4.50°C/W
	HS13	Apex Microtechnology	87	3 days	-	HEATSINK TO3 MOQ: 1 MPQ: 1	HEATSINK TO3	Apex Precision Power	Board Level	Rectangular, Fins	5.421" (139.70mm)	4.812" (122.22mm)	-	Bolt On	1.310" (33.27mm)	-	0.40°C/W @ 800 LFM	1.48°C/W
	501303B00000G	Aavid, Thermal Division of Boyd Corporation	5,511	3 days	-	HEAT SINK TO-3 .500" COMPACT MOQ: 1 MPQ: 1	HEAT SINK TO-3 .500" COMPACT	-	Board Level	Rhombus	1.880" (47.75mm)	1.400" (35.56mm)	-	Bolt On	0.500" (12.70mm)	2.0W @ 30°C	4.00°C/W @ 300 LFM	12.00°C/W
	501403B00000G	Aavid, Thermal Division of Boyd Corporation	1,707	3 days	-	HEAT SINK TO-3 .750" COMPACT MOQ: 1 MPQ: 1	HEAT SINK TO-3 .750" COMPACT	-	Board Level	Rhombus	1.880" (47.75mm)	1.400" (35.56mm)	-	Bolt On	0.750" (19.05mm)	4.0W @ 40°C	3.00°C/W @ 400 LFM	10.00°C/W
	501603B00000G	Aavid, Thermal Division of Boyd Corporation	2,970	3 days	-	HEAT SINK TO-3 1.25" COMPACT MOQ: 1 MPQ: 1	HEAT SINK TO-3 1.25" COMPACT	-	Board Level	Rhombus	1.880" (47.75mm)	1.400" (35.56mm)	-	Bolt On	1.250" (31.75mm)	4.0W @ 30°C	3.00°C/W @ 200 LFM	7.80°C/W
	579103B00000G	Aavid, Thermal Division of Boyd Corporation	8,223	3 days	-	HEATSINK TO-3 BLACK .87" MOQ: 1 MPQ: 1	HEATSINK TO-3 BLACK .87"	-	Top Mount	Rhombus	1.540" (39.12mm)	-	1.125" (28.57mm) OD	Bolt On	0.870" (22.10mm)	2.5W @ 40°C	4.00°C/W @ 600 LFM	12.50°C/W
	569003B00000G	Aavid, Thermal Division of Boyd Corporation	1,277	3 days	-	COOLER FOR TO-3 20 WATTS MOQ: 1 MPQ: 1	COOLER FOR TO-3 20 WATTS	-	Board Level	Square, Pin Fins	1.830" (46.48mm)	1.830" (46.48mm)	-	Bolt On	1.310" (33.27mm)	12.0W @ 60°C	1.50°C/W @ 500 LFM	5.50°C/W
	UP-T03-CB	CTS Thermal Management Products	1,248	3 days	-	HEATSINK PWR MED-HI BLACK TO-3 MOQ: 1 MPQ: 1	HEATSINK PWR MED-HI BLACK TO-3	-	Board Level	Square, Pin Fins	1.780" (45.21mm)	1.780" (45.21mm)	-	Bolt On	1.000" (25.40mm)	-	-	9.00°C/W
	680-125A	Wakefield-Vette	161	3 days	-	HEATSINK POWER TO-3 BLK MOQ: 1 MPQ: 1	HEATSINK POWER TO-3 BLK	680	Board Level	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	Bolt On	1.250" (31.75mm)	7.5W @ 45°C	1.50°C/W @ 400 LFM	6.00°C/W
	501503B00000G	Aavid, Thermal Division of Boyd Corporation	6,006	3 days	-	HEATSINK TO-3 1.00" BLK MOQ: 1 MPQ: 1	HEATSINK TO-3 1.00" BLK	-	Board Level	Rhombus	1.880" (47.75mm)	1.400" (35.56mm)	-	Bolt On	1.000" (25.40mm)	5.0W @ 40°C	2.00°C/W @ 500 LFM	8.40°C/W
	505403B00000G	Aavid, Thermal Division of Boyd Corporation	3,757	3 days	-	HEATSINK TO-3 H31.75MM MOQ: 1 MPQ: 1	HEATSINK TO-3 H31.75MM	-	Board Level	Square, Pin Fins	1.780" (45.21mm)	1.780" (45.21mm)	-	Bolt On	1.250" (31.75mm)	7.0W @ 40°C	1.50°C/W @ 600 LFM	6.00°C/W
	500103B00000G	Aavid, Thermal Division of Boyd Corporation	3,911	3 days	-	HEATSINK TO-3 10W H=.50" BLK MOQ: 1 MPQ: 1	HEATSINK TO-3 10W H=.50" BLK	-	Board Level	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	Bolt On	0.500" (12.70mm)	6.0W @ 50°C	2.50°C/W @ 400 LFM	7.20°C/W
	ATS-PCBT1089	Advanced Thermal Solutions Inc.	966	3 days	-	HEATSINK TO-3 BLACK MOQ: 1 MPQ: 1	HEATSINK TO-3 BLACK	-	Board Level	Square, Fins	2.520" (64.00mm)	2.520" (64.00mm)	-	Bolt On	0.917" (23.30mm)	-	2.60°C/W @ 200 LFM	6.00°C/W
	ATS-PCB1043	Advanced Thermal Solutions Inc.	2,884	3 days	-	HEATSINK TO-3 MOQ: 1 MPQ: 1	HEATSINK TO-3	-	Board Level	Rhombus	2.507" (63.67mm)	1.867" (47.41mm)	-	Bolt On	1.667" (42.33mm)	-	2.60°C/W @ 200 LFM	7.50°C/W
	576203B00000G	Aavid, Thermal Division of Boyd Corporation	201	3 days	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	Board Level	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	Bolt On	0.750" (19.05mm)	4.0W @ 30°C	2.50°C/W @ 400 LFM	6.20°C/W
	HS14	Apex Microtechnology	48	3 days	-	HEATSINK 8P TO-3 1.7C/W MOQ: 1 MPQ: 1	HEATSINK 8P TO-3 1.7C/W	Apex Precision Power	Board Level	Rectangular, Fins	3.000" (76.20mm)	4.812" (122.22mm)	-	Bolt On	1.310" (33.27mm)	-	1.00°C/W @ 200 LFM	2.00°C/W

Sent successfully!