- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
201
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3 days |
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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4.0W @ 30°C | 2.50°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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12.0W @ 70°C | 1.50°C/W @ 700 LFM |
